Compressible Thermal Interface Material with Phase Change
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Solution Overview
Problem
Traditional thermal interface materials lack excellent thermal performance and compressibility, which are essential for effective heat dissipation from electronic components to heat spreaders and sinks.
Innovation Solution
A compressible thermal interface material comprising a polymer, thermally conductive filler, and phase change material with specific needle penetration values, designed to maintain thermal conductivity while compressing and expanding, and optionally including additives like antioxidants and crosslinking agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional thermal interface materials are used, then thermal performance is achieved, but compressibility is insufficient
Solution Approach 1:
The patent employs a composite material system combining polymer matrix, thermally conductive filler (such as aluminum oxide, boron nitride, or metal particles), and phase change material. This composite structure enables the material to simultaneously achieve high thermal conductivity from the filler particles and excellent compressibility from the polymer matrix, while the phase change material provides adaptive response to thermal conditions. The synergistic combination resolves the contradiction between maintaining thermal performance and achieving sufficient compressibility.
Solution Approach 2:
The patent utilizes phase change material that undergoes parameter changes (phase transitions) in response to temperature variations. This allows the thermal interface material to dynamically adjust its properties, providing both thermal management capability and adaptability to different compression states. The parameter change principle enables the material to maintain effective thermal contact while accommodating varying compressibility requirements.
2Adaptability or versatility
If compressibility is increased to improve contact, then thermal performance may deteriorate
Solution Approach 1:
The composite material structure with thermally conductive filler dispersed in a polymer matrix allows independent optimization of compressibility and thermal conductivity. The filler particles maintain thermal pathways even when the polymer matrix compresses, ensuring that thermal performance is preserved while the material achieves necessary compressibility for good contact.
Solution Approach 2:
The patent applies local quality by creating regions with different filler concentrations or particle sizes within the thermal interface material. This allows certain areas to provide enhanced compressibility while other regions maintain high thermal conductivity, resolving the contradiction between these two properties at different locations within the same material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves improved thermal performance and compressibility, allowing for efficient heat transfer and contact with electronic components, even under pressure and temperature variations, while maintaining thermal impedance within acceptable limits.
Implementation Method 1
the phase change material comprises a wax having a needle penetration value of at least 50 as determined by ASTM D1321, at 25°C
Implementation Method 2
a thermally conductive filler
Data Source
Figure 1A~1D
Figure 2A~2B
Figure 3
AI summary
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.