Compressible Tray Design for Solid Precursor Ampoule Heat Transfer
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Solution Overview
Problem
Existing delivery systems for solid precursor materials in Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) processes face challenges in efficiently transferring heat to the precursor materials due to limited contact with the inner surface of the ampoule, which affects the processing efficiency and consistency in wafer manufacturing.
Innovation Solution
The development of a compressible tray design that can be easily inserted into the ampoule with a reduced profile size for ease of installation and then expands to maximize contact with the inner surface, utilizing spring potential energy to enhance heat transfer through thermal components and structures like accordion-like surfaces or open-rings, allowing for improved thermal energy delivery to the precursor materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the tray is designed with a rigid structure for stable heat transfer, then heat transfer efficiency is improved, but the difficulty of inserting the tray into the ampoule increases
Solution Approach 1:
The tray incorporates a compressible portion that allows the tray to dynamically change its structure. During insertion, the tray is compressed to a reduced profile size for ease of insertion. Once inside the ampoule, the compressible portion expands to maximize contact with the inner surface, thereby improving heat transfer efficiency. This dynamic transformation resolves the contradiction between rigid structure for heat transfer and flexibility for insertion.
Solution Approach 2:
The compressible portion allows the tray to nest within itself during insertion by compressing to a smaller profile. After insertion, it expands back to its full size to provide stable heat transfer contact with the ampoule inner surface. This nesting capability enables the tray to fit into the ampoule easily while maintaining the ability to provide stable thermal contact.
2Ease of operation
If the tray is made flexible to ease insertion, then ease of operation is improved, but heat transfer stability deteriorates
Solution Approach 1:
The tray transitions from a flexible compressed state during insertion to a stable expanded state during operation. The compressible portion is designed to maintain reliable thermal contact once expanded, ensuring heat transfer stability while allowing easy insertion when compressed.
3Ease of operation
If the tray profile is reduced for easier insertion, then ease of operation is improved, but the contact area with the inner surface decreases
Solution Approach 1:
The tray dynamically changes its profile size: compressed to a reduced profile for easy insertion, then expanded to maximize contact area with the ampoule inner surface for optimal heat transfer. This dynamic size transformation resolves the contradiction between reduced profile for insertion and large contact area for heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer to the solid precursor materials, improving processing efficiency and consistency in ALD and CVD processes by ensuring effective thermal contact and energy delivery, thereby enhancing the fabrication of microelectronic devices.
Implementation Method 1
a compressible portion having a compressed state and a relaxed state, wherein a spring potential energy in the compressible portion is higher than in the relaxed state
Implementation Method 2
the heat-transfer component and the second heat-transfer component are configured to be in thermal contact with an inner wall surface of the ampoule, and the heat-transfer component and the second heat-transfer component are configured to transfer thermal energy from the inner wall surface of the ampoule to the compressible portion
Data Source
AI summary
A tray for an ampoule of a delivery system of solid precursor materials used in Atomic Layer Deposition (ALD) processes, Chemical Vapor Deposition (CVD) processes or both. The tray is configured to be able to have a reduced profile size when compressed to enhance the ease of which the tray can be inserted into the ampoule, and the tray is configured to expand in size to make improved contact with inner wall surfaces of the ampoule to provide improved heat transfer from the inner wall to the tray and ultimately to the solid precursor materials disposed on the tray.