Compressing Jig Pitching Plates for Semiconductor Alignment
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Solution Overview
Problem
Conventional semiconductor device packaging apparatuses struggle to maintain parallel alignment and uniform thickness of substrates and heat spreaders, leading to uneven thermal conductive adhesive distribution and unstable heat dissipation, affecting the operating temperature and performance of semiconductor devices.
Innovation Solution
A compressing apparatus with a jig comprising a lower and upper compressing assembly, featuring pitching plates, limiting sets, and clamping plates, which uses an elevating mechanism, vacuum pump, and pneumatic or electric driving assemblies to ensure even compression and alignment of semiconductor devices, ensuring parallel alignment and uniform adhesive distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging apparatus presses substrate and heat spreader, then they are combined together, but parallel alignment and uniform thickness cannot be maintained
Solution Approach 1:
The pressing device is divided into multiple independent pressing units, each capable of applying pressure to specific regions of the substrate and heat spreader. This segmentation allows for localized control of pressure and alignment, enabling simultaneous combination of components while maintaining parallel alignment and uniform thickness across the entire assembly.
2Reliability
If thermal conductive adhesive is coated on substrate, then substrate and heat spreader are fixed together, but uneven distribution occurs
Solution Approach 1:
The apparatus applies preliminary compression force to the substrate and heat spreader assembly before the thermal conductive adhesive fully cures. This preliminary action ensures that the components are held in precise parallel alignment and uniform thickness positions, allowing the adhesive to distribute evenly and bond the components together while maintaining the desired geometric precision.
Data Source
AI summary
A compressing apparatus has a compressing jig and a pressing device. The compressing jig has a lower compressing assembly and an upper compressing assembly. The lower compressing assembly has a lower mount with at least one pitching plate and at least one limiting set. Each one of the at least one limiting set has multiple poles disposed around a corresponding pitching plate. Each one of the multiple poles has a top end higher than the corresponding pitching plate and a limiting indention disposed at the top end with a supporting portion disposed at a same height with the corresponding pitching plate. The upper compressing assembly has at least one clamping plate respectively aligned with the at least one pitching plate and being movable up and down. The pressing device has a base with a receiving space to receive the upper compressing assembly.