Vertical Compression Connector Terminal for Lower High-Frequency Impedance

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Solution Overview

Problem

Existing electrical terminals have high impedance due to air surrounding the elastic arm, which affects high frequency performance.

Innovation Solution

The design includes a first and second elastic arm with a protruding portion and a contact surface, increasing capacitance by overlapping contact surfaces vertically, and a third elastic arm to enhance the width in the front-rear direction, forming multiple conductive paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If air surrounds the elastic arm of each electrical terminal, then the structure is simple and easy to manufacture, but the dielectric coefficient is small causing greater impedance and degraded high frequency performance

Engineering Contradiction:
Improvestructural simplicityVSAvoidhigh frequency performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a dielectric member as an intermediary substance filling the space around the elastic arm. This dielectric member has a higher dielectric coefficient than air, which reduces the impedance of the elastic arm and improves high frequency signal transmission performance while maintaining the overall structural simplicity of the electrical terminal

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical parameter of the surrounding medium from air (low dielectric coefficient) to a dielectric member (high dielectric coefficient). This parameter change directly reduces the impedance of the elastic arm, thereby improving high frequency performance without requiring complex structural modifications

Inventive Principle:
Principle #35Parameter changes

2Reliability

If multiple elastic arms are formed side by side, then capacitance increases and impedance decreases, but the device complexity increases

Engineering Contradiction:
Improveimpedance reductionVSAvoidnumber of elastic arms
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple elastic arms into a single integrated structure where multiple elastic arms extend side by side from the base. These elastic arms are formed as one unified component rather than separate parts, increasing capacitance and reducing impedance while minimizing the increase in device complexity through integrated design

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces impedance and improves high frequency performance by increasing capacitance, allowing for efficient electrical connections with reduced pressure requirements.

Implementation Method 1

the high frequency performance are improved by increasing the capacitance of the elastic arm of each electrical terminal

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUSRE50783E1Electrical terminal and electrical connector in vertical compression contact with chip module
Publication Date: 2026.02.03 LOTES
  • USRE50783E1 patent drawing
  • USRE50783E1 patent drawing
  • USRE50783E1 patent drawing

AI summary

An electrical terminal includes a base, a first elastic arm and a second elastic arm formed side by side by extending upwardly from an upper end of the base, and a protruding portion. The first elastic arm has a mating portion, and the second elastic arm has a contact portion. The protruding portion protrudes and extends from a first side of the first elastic arm, and the first side of the first elastic arm is adjacent to the second elastic arm. A lower surface of the protruding portion has a contact surface overlapping with the contact portion in a vertical direction, such that the contact portion upwardly abuts the contact surface. When the chip module presses downwardly on the electrical terminal, the contact portion can move on the contact surface, such that the chip module does not need to press downwardly on the contact portion with a relatively large pressure.