Camera Assembly With Compression-Based Optical Axis Alignment
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Solution Overview
Problem
Existing camera production methods suffer from optical axis misalignments due to connection and manufacturing tolerances, leading to reduced vehicle environment detection accuracy.
Innovation Solution
A method involving precise optical measurements and alignments using a compression element to adjust the objective and image sensor along multiple axes, eliminating the need for adhesives and ensuring a common optical axis, which includes steps like optical measurement, compression, and laser welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional production methods are used to assemble camera components, then production speed and ease of manufacture are improved, but optical axis misalignment occurs due to connection and manufacturing tolerances
Solution Approach 1:
The patent applies preliminary action by pre-adjusting the objective holder with support pins to compensate for image surface tilt before final assembly. The support pins are designed with specific geometries (e.g., inclined surfaces, adjustable mechanisms) that pre-correct for anticipated manufacturing tolerances and connection variations, allowing the optical axis to remain aligned despite subsequent assembly variations.
Solution Approach 2:
The patent employs parameter changes by varying the support pin configurations across different objective holder classes. Each class is designed with specific pin geometries, positions, or adjustment ranges tailored to compensate for particular tilt characteristics, allowing adaptation to different objective and sensor combinations while maintaining alignment precision.
2Ease of manufacture
If adhesive is used to connect components, then ease of manufacture is improved, but unwanted changes in optical properties occur due to temperature and moisture
Solution Approach 1:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical bonding system using support pins and precise geometric fittings. The objective holder is mechanically supported by pins that engage with corresponding features on the circuit carrier, eliminating adhesive joints that could degrade under temperature and moisture variations, thereby ensuring long-term optical stability.
3Manufacturing precision
If different classes of objective holders are provided to compensate for image surface tilt, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent achieves universality by designing a modular objective holder system where the basic structure remains consistent across classes, but the support pin configurations are varied to handle different tilt scenarios. This allows a single objective holder design family to serve multiple compensation purposes, reducing the need for entirely different holder designs for each tilt case.
Solution Approach 2:
The patent applies local quality by making specific modifications only to the support pin regions of the objective holder while keeping the overall holder structure standardized. Each pin can be independently configured (different angles, lengths, or adjustment mechanisms) to address local tilt issues without redesigning the entire holder, thereby managing complexity efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces cameras with high sharpness and consistent optical properties over the service life, reducing production costs and avoiding unwanted changes in optical properties due to temperature or moisture, while ensuring precise alignment and stability.
Implementation Method 1
compressing the compression element depending on the optical measurement of the circuit carrier assembly and the optical measurement of the objective fastened to the camera housing, for adjusting an alignment of the objective with respect to the circuit carrier assembly
Implementation Method 2
optically measuring the circuit carrier assembly for ascertaining a position of the image sensor on the circuit carrier; optically measuring the objective fastened to the camera housing, for ascertaining a focus and an image plane tilt of the objective
Implementation Method 3
connecting the circuit carrier assembly and the camera housing
Data Source
AI summary
A method for producing a camera. The method includes: assembling a circuit carrier and a metal frame on a surface of the circuit carrier that carries an image sensor; optically measuring the circuit carrier assembly; introducing an objective with an objective housing into a camera housing, wherein the camera housing has a camera housing collar that extends into an interior of the camera housing and has a compression element arranged on a side facing the image sensor; fastening the objective housing to the camera housing; optically measuring the objective fastened to the camera housing; compressing the compression element depending on the optical measurements; arranging the circuit carrier assembly on the camera housing and aligning along two further coordinate axes and a further rotation axis; and connecting the circuit carrier assembly and the camera housing.