Compression Molding Resin Composition for Wafer Warpage Suppression
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Solution Overview
Problem
Existing liquid resin compositions for compression molding fail to sufficiently reduce warpage in larger or thinner silicon wafers, which is a critical issue for achieving cost reduction and miniaturization in electronic component packaging, particularly affecting semiconductor wafers like SiC, sapphire, and GaAs wafers.
Innovation Solution
A liquid resin composition comprising an aliphatic epoxy compound, an epoxy compound with an aromatic ring, a nitrogen-containing heterocyclic compound, and an inorganic filler, where the aliphatic epoxy compound constitutes 3-40% by mass, the epoxy compound with an aromatic ring has a viscosity of 30 mPa·s to 5000 mPa·s, and the nitrogen-containing heterocyclic compound is an imidazole, effectively reducing warpage in semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional epoxy resin compositions are used for sealing silicon wafers, then productivity and cost are improved, but warpage of the silicon wafer occurs due to stress from cure shrinkage and thermal expansion mismatch
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy resin by incorporating specific flexibilizing agents (polyester polyol, polyether polyol) in controlled amounts (5-50 wt%, 2-30 wt%) to reduce cure shrinkage stress and thermal expansion mismatch, thereby reducing wafer warpage while maintaining productivity
Solution Approach 2:
The patent creates a composite epoxy resin system by combining conventional epoxy resin with flexibilizing agents and inorganic fillers, forming a multi-component composition that reduces stress through the synergistic effects of the different materials while maintaining the productivity benefits of epoxy sealing
2Manufacturing precision
If high filling of inorganic filler is used to decrease thermal expansion coefficient, then stress is reduced, but elastic modulus increases making it impossible to sufficiently reduce warpage of large-sized silicon wafers
Solution Approach 1:
The patent adjusts the chemical composition parameters by introducing flexibilizing agents with specific molecular structures (polyester polyol, polyether polyol) that reduce the elastic modulus of the cured resin, allowing stress reduction through composition control rather than relying solely on high inorganic filler content
3Strength
If silicone rubber fine particles or core-shell silicone polymer are used to decrease elastic modulus, then stress is reduced, but warpage of thinner or larger silicon wafers cannot be sufficiently reduced
Solution Approach 1:
The patent changes the chemical nature of the flexibilizing component by using polyester polyol and polyether polyol with specific hydroxyl values and molecular weight ranges, creating a flexible segment that reduces elastic modulus while maintaining adequate stress reduction capability for thin and large wafers
Solution Approach 2:
The patent creates local flexibility within the epoxy matrix by incorporating flexibilizing agents that provide stress relief at the molecular level, creating zones of reduced rigidity that accommodate thermal expansion differences without requiring uniform reduction of elastic modulus throughout the entire material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively suppresses warpage in semiconductor wafers, improving the reliability and reducing stress in electronic component packaging, enabling the use of larger or thinner wafers while maintaining heat resistance and curability.
Implementation Method 1
a liquid resin composition for compression molding, comprising an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule...
Implementation Method 2
a nitrogen-containing heterocyclic compound (C), wherein the nitrogen-containing heterocyclic compound (C) comprises an imidazole...
Implementation Method 3
The warpage of a silicon wafer is considered to be caused by stress generated by the cure shrinkage of such an epoxy resin composition, a mismatch between the thermal expansion coefficients of the silicon wafer and the epoxy resin composition...
Data Source
AI summary
A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).