Compressor Electronics Cooling With Refrigerant Dry-Out Control
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Solution Overview
Problem
Compressor systems that use refrigerant to cool electronics face overheating issues due to heat generated by control electronics, leading to potential shutdowns or malfunctions.
Innovation Solution
A system where a temperature sensor monitors the low-pressure refrigerant and controls the expansion valve to adjust the refrigerant flow through heat exchangers, managing the liquid dry out point and superheating to efficiently cool the electronics module, using a variable speed compressor and inverter for optimal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electronics module is mounted externally to control compressor capacity, then the compressor capacity can be modulated by varying motor speed, but the electronics generate heat that causes overheating
Solution Approach 1:
The patent combines the electronics module mounting with the compressor shell to utilize the refrigerant cooling system. The electronics are mounted on the compressor shell where they are cooled by the refrigerant passing through internal passages, merging the cooling function with the existing refrigerant circulation system rather than using separate cooling apparatus.
Solution Approach 2:
The refrigerant acts as an intermediary cooling medium between the heat-generating electronics and the external environment. The refrigerant absorbs heat from the electronics module through thermal conduction via the mounting structure and carries it away through the refrigeration cycle, effectively mediating the heat transfer process.
2Temperature
If refrigerant flow is increased to cool electronics, then cooling effectiveness improves, but liquid dry out point control becomes difficult and superheating increases
Solution Approach 1:
The patent employs feedback control through temperature sensors that monitor refrigerant temperature and provide signals to the expansion valve controller. This closed-loop feedback system continuously adjusts the refrigerant flow to maintain optimal cooling of the electronics while preventing liquid dry out and excessive superheating, ensuring reliable operation.
Solution Approach 2:
The system uses dynamic adjustment of refrigerant flow through the expansion valve based on real-time temperature conditions. The flow rate is not fixed but continuously varies to match the cooling demands of the electronics module, optimizing cooling effectiveness while maintaining proper refrigerant management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages overheating by controlling refrigerant flow, minimizing temperature fluctuations and superheating, which reduces the risk of electronic component failure, allows for smaller cooling apparatus design, and increases the current rating of solid-state switches, thereby reducing costs and improving system reliability.
Implementation Method 1
a cooling apparatus receives the low-pressure refrigerant... the cooling apparatus may include a cold plate having a plurality of passageways for carrying the low-pressure refrigerant
Implementation Method 2
An expansion valve is disposed between the heat exchangers... converts the high-pressure refrigerant to a low-pressure refrigerant
Implementation Method 3
A temperature sensor detects a temperature of the low-pressure refrigerant passing through the system
Data Source
AI summary
A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.