Compressor Electronics Cooling With Refrigerant LDOP Feedback
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Solution Overview
Problem
Compressor systems that use refrigerant to cool electronics face overheating issues due to heat generated by the electronics, which can lead to malfunction or failure if not properly managed.
Innovation Solution
A system where a temperature sensor monitors the low-pressure refrigerant and controls the expansion valve to adjust the flow through a cooling apparatus, managing the liquid dry out point (LDOP) and superheating, ensuring efficient cooling of the electronics module by varying the refrigerant flow based on temperature fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electronics module is mounted on the compressor shell to control motor speed, then compressor capacity modulation is achieved, but the electronics generate heat that can cause overheating and malfunction
Solution Approach 1:
The patent introduces a cold plate as an intermediary thermal management device between the electronics module and the compressor shell. The cold plate absorbs heat from the electronics module through thermal contact, transferring it to the refrigerant flowing through its channels, thereby preventing direct heat accumulation on the electronics while maintaining compressor control functionality
Solution Approach 2:
The patent utilizes the refrigerant fluid flowing through the cold plate channels to remove heat from the electronics module. By circulating the refrigerant through the cold plate, thermal energy is extracted from the electronics via the fluid medium, solving the overheating problem while maintaining the electronics' mounting position on the compressor shell
2Temperature
If the cold plate is designed with multiple channels to increase cooling capacity, then heat dissipation improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The cold plate is segmented into multiple parallel channels within a single integrated component. This segmentation allows the refrigerant to flow through multiple pathways simultaneously, increasing the effective heat transfer surface area and cooling capacity while maintaining a relatively simple monolithic structure that is manufacturable using standard casting or machining processes
3Temperature
If refrigerant flow through the cold plate is increased to enhance cooling, then electronics temperature decreases, but the liquid dry out point and superheating control become more difficult
Solution Approach 1:
The patent implements a feedback control system where a temperature sensor monitors the refrigerant temperature at the cold plate outlet, and this information is fed back to the expansion valve controller. The controller adjusts the refrigerant flow rate through the expansion valve to maintain optimal cooling of the electronics while preventing liquid dry out and controlling superheating, thereby balancing cooling efficiency with refrigerant flow reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents overheating by optimizing refrigerant flow, reducing the risk of electronics failure, minimizing temperature fluctuations, and allowing for higher current ratings and lower costs by maintaining lower electronic component junction temperatures.
Implementation Method 1
a cooling apparatus is proximate the electronics module that utilizes the low-pressure refrigerant to cool the electronics module
Implementation Method 2
an expansion valve is disposed between the heat exchangers
Data Source
AI summary
A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.