Integrated Electric Compressor PCB Layout for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated electric compressors for vehicle-mounted air conditioners face challenges in miniaturization due to the large size of package parts for switching elements, which leads to increased board thickness and protrusion issues, and heat management limitations.
Innovation Solution
The use of bare-chip assembly for IGBTs and diodes on a first board, with a separate control circuit board for controlling the switching elements, allows for miniaturization and efficient heat dissipation by positioning heat-generating components along the refrigerant flow path, while non-heat-generating components are placed in areas with reduced cooling needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If package parts are used for switching elements, then the switching elements can be easily manufactured and assembled, but the board size increases and may protrude sideways from the electric compressor
Solution Approach 1:
The patent changes the physical form parameter of the switching elements from packaged components to bare-chip mounted components. This parameter change reduces the size of the switching elements significantly, allowing the board to fit within the housing without protruding sideways while maintaining manufacturability through standardized bare-chip mounting processes
2Area of stationary object
If the board is divided into multiple layers to prevent protrusion, then the board can fit within the housing, but the board thickness increases virtually
Solution Approach 1:
The patent addresses the size constraint by transitioning from a two-dimensional board layout problem to a three-dimensional component mounting solution. By mounting switching elements directly on the board surface in a compact arrangement rather than distributing them across multiple layers, the solution reduces the board's footprint without significantly increasing its thickness
3Temperature
If heat-generating parts are disposed along the refrigerant flow path for cooling, then heat radiation is improved, but the arrangement of parts is limited and miniaturization becomes difficult
Solution Approach 1:
The patent applies local quality by creating distinct functional zones on the board: heat-generating switching elements are positioned in the refrigerant flow path for active cooling, while non-heat-generating control circuit components are positioned in areas with reduced cooling requirements. This spatial differentiation of component placement based on thermal characteristics enables both effective heat dissipation and part miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the miniaturization of the control board while ensuring effective heat radiation, reducing the overall size of the electric compressor and maintaining efficient operation.
Implementation Method 1
these parts are disposed along the portion of the housing in which the refrigerant flows so that these parts are cooled by a refrigerant flowing in the housing
Data Source
AI summary
The object is to provide an integrated compressor that enables a control board to be miniaturized while ensuring a layout in which the heat radiation of parts is considered. Diodes 43 and IGBTs 42 that correspond to each of the U-phase, V-phase and W-phase are arrayed in series for each phase. Rectangular chips are used for the diodes 43 and IGBTs 42. As a result of this, a power board 16 is substantially miniaturized, and the diode 43, the IGBT 42, a P-terminal electrode pattern 40, an N-terminal electrode pattern 41, a shunt resistor 44, output terminal patterns 48U, 48V, 48W, and a feed pattern 50 are disposed so as to lie in a region in contact with an outer surface of a housing.