Computational Heat Dissipation Structure With Unequal Component Spacing
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Solution Overview
Problem
Modern computing devices face challenges in balancing heat dissipation efficiencies across different components due to uneven heat distribution, leading to instability, reduced performance, and shorter component life, with existing air cooling methods increasing fan load.
Innovation Solution
A computational heat dissipation structure with unequally spaced heating components and a radiator system comprising a main and auxiliary heat sink, along with thermal conductive materials, is used to balance heat dissipation efficiencies and reduce fan load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling with fan is used to dissipate heat from heating components, then heat dissipation is achieved, but fan load increases and temperature equalization is poor
Solution Approach 1:
The patent applies local quality by creating temperature equalization zones with different air flow characteristics. The air duct is divided into multiple zones with different air flow resistance, allowing each zone to be optimized for its local heat dissipation needs. This resolves the contradiction by achieving uniform temperature distribution (improving heat dissipation efficiency) without requiring uniformly high air flow throughout, thus reducing overall fan load.
Solution Approach 2:
The air duct is segmented into multiple temperature equalization zones with different air flow resistance characteristics. Each zone is independently designed to handle the thermal load of specific heating components. This segmentation allows the system to achieve effective heat dissipation across all components while distributing the fan load more efficiently across different zones rather than requiring high uniform flow throughout.
2Stability of the object's composition
If fan rotation speed is increased to improve temperature equalization, then temperature in hottest region satisfies requirement, but fan load increases
Solution Approach 1:
Different zones of the air duct are designed with different air flow resistance to create localized flow patterns that optimize temperature equalization in each zone. This allows the system to achieve good temperature uniformity across all heating components without requiring the fan to operate at high speed uniformly, thus reducing fan load while maintaining temperature stability.
3Productivity
If heating components are deployed in equal space on circuit board, then component integration is achieved, but temperature difference between air inlet and outlet is large
Solution Approach 1:
The air duct is segmented into multiple temperature equalization zones corresponding to different regions of the circuit board. Each zone has optimized air flow resistance to handle the thermal load of components in that region. This segmentation allows components to be densely integrated while maintaining uniform temperature distribution by providing targeted air flow to each zone rather than relying on uniform flow across the entire board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively balances heat dissipation across components, reduces fan load, and prolongs component life by dynamically adjusting fan speed and component frequencies based on temperature data.
Implementation Method 1
Radiators made of a material with high thermal conductive efficiency are mounted on the high heating components
Implementation Method 2
active heat dissipation is carried out through a fan
Implementation Method 3
a thermal conductive material is filled in a gap between the auxiliary heat sink and the circuit board
Data Source
AI summary
A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.