Computational Metrology Correction for Patterning Process Control
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Solution Overview
Problem
Current device manufacturing processes face challenges in accurately correcting patterning processes due to variations in substrate quality and processing conditions, leading to inconsistencies in overlay, critical dimension, and focus, which affect the overall quality of integrated circuits.
Innovation Solution
A method is introduced that uses a hardware computer system to select a representative quality from a plurality of parameter maps generated from metrology data and apparatus data, applying weighted averaging or correction potential to determine and apply corrections to the patterning process for subsequent substrates, thereby improving process accuracy and consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If corrections are determined for each substrate individually using metrology data, then measurement precision is improved, but device complexity increases due to processing multiple parameter maps
Solution Approach 1:
The patent extracts only the essential characteristics from multiple parameter maps by selecting a representative quality that captures the dominant variation patterns. This extraction approach maintains measurement precision by preserving critical information while eliminating redundant data, thereby reducing device complexity in processing and storing multiple complete parameter maps.
Solution Approach 2:
The patent transforms multiple complex parameter maps into a simplified representative quality through parameter transformation. By changing the representation from multiple detailed maps to a single synthesized quality metric, the system maintains the ability to detect and correct patterning variations while reducing computational complexity and data storage requirements.
2Device complexity
If a representative quality is selected from multiple parameter maps, then device complexity is reduced, but manufacturing precision may be compromised by losing detailed variation information
Solution Approach 1:
The patent implements feedback by using the selected representative quality to determine corrections that are then applied to subsequent substrates. This feedback loop ensures that the simplified representative quality effectively captures the essential variation patterns needed for maintaining manufacturing precision, as the corrections are continuously refined based on measured outcomes from previous substrates.
Solution Approach 2:
The patent performs preliminary analysis by selecting the representative quality from initial parameter maps before processing subsequent substrates. This preliminary action establishes correction parameters in advance based on the most informative quality metrics, enabling efficient processing of subsequent substrates while maintaining manufacturing precision through pre-determined correction strategies.
Data Source
AI summary
A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.