Compute Assembly Cold Plate for Dense Blade Thermal Management

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

High-performance computing systems face challenges in efficient space utilization, cooling, and signal transmission due to the need for multiple processors, complex circuit boards, and high-speed communication, which results in significant electrical losses and thermal management issues within compact compute blades.

Innovation Solution

The compute assembly integrates a network interface card (NIC) closely proximate to the processor, utilizing a single cold plate for dual cooling and employing riser cards for efficient signal transmission between boards, along with alignment and mounting structures to optimize space and thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple processors and components are integrated into compact compute blades, then computing density and space utilization are improved, but thermal management becomes more difficult and signal transmission losses increase

Engineering Contradiction:

Improvecompute blade densityVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent combines multiple cooling functions into a single integrated cold plate structure that simultaneously cools both the processor and network interface card. This merging approach maintains high compute blade density while effectively managing thermal loads from multiple heat-generating components through a unified cooling system.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cold plate is positioned between the processor board and network interface board, with cooling channels nested within the cold plate structure. This nested arrangement allows the cooling system to be integrated within the compact compute blade without increasing overall volume, thereby maintaining high density while managing thermal constraints.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

If multiple circuit boards are used for high-speed communication, then processing capability is improved, but electrical signal loss increases

Engineering Contradiction:

Improveprocessing capabilityVSAvoidsignal loss

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The cold plate serves as an intermediary structure between the processor board and network interface board, providing both thermal management and a stable mechanical platform for signal transmission. This intermediary structure helps maintain signal integrity by reducing board flex and connection instability that would otherwise increase signal loss in high-speed communications.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If components are closely integrated to maximize space, then space efficiency is improved, but cooling of individual components becomes more difficult

Engineering Contradiction:

Improvespace efficiencyVSAvoidcooling implementation

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent merges the cooling of the processor and network interface card into a single cold plate system, simplifying the manufacturing process while maintaining effective cooling of both components. This unified approach avoids the complexity of implementing separate cooling systems for closely integrated components.

Inventive Principle:

Principle #5Merging (Combining)

4Speed

If high-speed signal transmission is implemented, then computing performance is improved, but electrical losses and signal deterioration increase

Engineering Contradiction:

Improvesignal transmission speedVSAvoidelectrical loss

Core Design Contradiction:

SpeedVSLoss of energy

Solution Approach 1:

The cold plate acts as an intermediary structure that provides mechanical stability and reduces board flex between the processor and network interface. This stability minimizes signal path variations and connection instability, thereby reducing signal deterioration and electrical losses during high-speed transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances space efficiency, reduces signal loss, and effectively manages heat within compute blades, enabling high-speed computing operations while minimizing physical and thermal constraints.

Implementation Method 1

a cold plate incorporated or included in the compute assembly, positioned between the processor board assembly and the network interface card assembly, such that the cold plate provides cooling to both the processor and the network interface card

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10782749B2Compute assembly for high speed ultra dense compute blades

Publication Date: 2020.09.22 CRAY INC

AI summary

A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.