Computer Case Cooling via Funnel Airflow and Segmented Heat Sink
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Solution Overview
Problem
The challenge in cryptocurrency mining is the overheating of computing devices due to the addition of more powerful processing modules, which limits heat dissipation and increases the risk of device overheating.
Innovation Solution
A computing device assembly that includes a housing with a rail assembly, a first fan assembly for drawing air in, a heat sink assembly with a funnel to direct airflow across the processors, and a second fan assembly for expelling air, allowing for efficient heat dissipation through a combination of air flow and heat sink design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more powerful processing modules are added to increase mining capacity, then cryptocurrency mining capacity is improved, but heat dissipation capability deteriorates causing device overheating
Solution Approach 1:
The heat sink is divided into multiple segments with each segment having independent fins arranged at different angles. This segmentation allows each section to handle heat from specific processing modules independently, improving overall heat dissipation efficiency while accommodating high-power ASICs without causing device overheating
Solution Approach 2:
Different sections of the heat sink are designed with locally optimized fin configurations - with fins at different angles and densities tailored to the specific heat generation patterns of different processing modules. This local quality optimization ensures efficient heat dissipation from high-power ASICs while maintaining overall system thermal management
2Productivity
If additional processing modules are assembled to increase mining capacity, then computing power is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat sink utilizes three-dimensional fin structures with fins extending at multiple angles (including 45 degrees and other non-traditional angles) to create additional surface area and optimize airflow patterns. This dimensional optimization improves heat dissipation efficiency by enhancing convective heat transfer without increasing the horizontal footprint, allowing more processing modules to be accommodated
Solution Approach 2:
The heat sink employs composite construction combining aluminum extrusions with copper heat pipes or thermal pads. This composite material approach improves thermal conductivity from the processing modules to the fins while maintaining structural integrity, thereby improving heat dissipation efficiency and enabling higher mining capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective cooling of processors, allowing for the addition of more powerful ASICs without overheating, thereby increasing cryptocurrency mining capacity to up to 1200 Gh/s.
Implementation Method 1
a first fan assembly mounted on the rail assembly and configured to draw air into the interior of the housing
Implementation Method 2
a heat sink assembly mounted on the rail assembly, the heat sink assembly having a plurality of external faces for receiving one or more processors
Implementation Method 3
the heat sink assembly having a plurality of external faces for receiving one or more processors and defining an interior longitudinal channel
Implementation Method 4
a second fan assembly mounted on the rail assembly and configured to force air out of the housing
Data Source
AI summary
A computing device with efficient cooling is provided. The computing device includes a housing with a plurality of components disposed therein. The components can include a pair of fan assemblies, a funnel assembly, and a heat sink assembly. The funnel assembly can direct the air drawn into the housing through a longitudinal channel define in the heat sink assembly and can direct the air across an exterior portion of the heat sink assembly, allowing for efficient cooling of the processors affixed to an exterior of the heat sink assembly.