Computer Equipment Cooling via Dynamic Coolant Flow Control

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Solution Overview

Problem

Existing cooling methods for computer equipment do not account for individual differences in heat demand across electronic devices, leading to unnecessary wastage of thermal energy by maintaining operating temperatures below safe levels.

Innovation Solution

A method that monitors the temperatures of individual electronic devices and heat conductive materials, iteratively adjusting the coolant flow rate and temperature based on average and spread values to maintain safe operating temperatures, thereby optimizing cooling efficiency and energy savings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the coolant flow rate is increased to maintain safe operating temperatures of electronic devices, then the reliability of the equipment is improved, but the energy consumption increases

Engineering Contradiction:

Improvesafe operating temperature maintenanceVSAvoidcooling energy consumption

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The cooling system dynamically adjusts the coolant flow rate based on real-time temperature monitoring of individual electronic devices. The system transitions from static to dynamic operation by continuously modifying cooling parameters according to actual thermal conditions, ensuring reliable cooling while minimizing energy consumption.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the cooling parameters (flow rate, temperature) based on monitored temperature data from individual electronic devices. By adjusting these parameters iteratively, the system maintains safe operating temperatures without applying excessive cooling, thereby reducing energy waste.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If the coolant flow rate is increased to cool all electronic devices uniformly, then the temperature stability is improved, but the individual device temperature control precision deteriorates

Engineering Contradiction:

Improveoverall temperature stabilityVSAvoidindividual device temperature control

Core Design Contradiction:

Stability of the object's compositionVSMeasurement precision

Solution Approach 1:

The cooling system is segmented into individual control zones corresponding to each electronic device or heat sink. Temperature sensors monitor each device separately, and the control system adjusts cooling independently for each segment, allowing precise individual temperature control while maintaining overall system stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system applies different cooling conditions to different locations based on individual device requirements. Each electronic device receives customized cooling appropriate to its specific thermal conditions and operational demands, rather than uniform cooling across all devices.

Inventive Principle:

Principle #3Local quality

3Loss of energy

If the coolant flow rate is reduced to save energy, then the energy consumption is reduced, but the cooling reliability deteriorates

Engineering Contradiction:

Improvethermal energy wastageVSAvoidcooling adequacy

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The cooling system incorporates feedback from temperature sensors that continuously monitor the thermal state of electronic devices. This feedback information is used to adjust the coolant flow rate dynamically, reducing flow when cooling demand is low to save energy, while automatically increasing flow when temperature rises to maintain cooling reliability.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures safe operation of computer equipment while maximizing energy savings and potential heat recovery, preventing under-cooling of busy devices and reducing the risk of shutdown or failure.

Implementation Method 1

distributing the coolant from the said passageway to the heat sinks

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

pumping coolant into a passageway leading to the computer equipment

Methodology Applied

Scientific EffectPumping: Pump

Data Source

PatentUS10976788B2Method of cooling computer equipment

Publication Date: 2021.04.13 COOLTERA LTD

AI summary

Method of cooling computer equipment that includes pumping coolant into a passageway leading to computer equipment and distributing the coolant from the passageway to heat sinks. The method also includes iteratively adjusting a rate of cooling of electronic devices by the coolant directly or indirectly in dependence upon heat generated by the electronic devices. The method also includes monitoring the respective temperatures of the electronic devices or heat conductive material in thermal contact therewith. The method also includes iteratively calculating the average of the values that said temperatures have at a given time. The method also includes iteratively calculating a spread value indicative of the spread of said values and iteratively adjusting the rate of cooling of the electronic devices by the coolant in dependence upon the ratio of said spread value and a difference between said average and a predetermined maximum acceptable temperature.