Computer Modules With Apertures For Reduced Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The limited spacing between sockets in computer systems makes it difficult to accommodate a large number of stacked microelectronic packages, increasing the thickness of computer modules and limiting processing power.
Innovation Solution
The design of computer modules with apertures in the substrate that allow microelectronic packages to be partially or fully inserted, reducing the overall thickness and enabling a higher number of stacked semiconductor dies without increasing module thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a large number of semiconductor dies are stacked in microelectronic packages to increase processing power, then processing power is improved, but module thickness increases beyond the limited socket spacing
Solution Approach 1:
The patent implements nesting by placing microelectronic packages containing stacked semiconductor dies inside recesses formed in the substrate. The packages are positioned such that they extend only partially beyond the substrate surface, with the recess depth configured to accommodate the package height. This nesting approach allows multiple high-density packages to be mounted within the limited socket spacing without increasing the overall module thickness beyond the available space.
2Ease of manufacture
If microelectronic packages are mounted on the substrate surface, then ease of manufacture is improved, but the extension of packages from the substrate surface increases module thickness
Solution Approach 1:
The patent segments the substrate into regions with recesses and regions without recesses. Some microelectronic packages are positioned in recesses while others remain on the surface, allowing selective thickness reduction for specific high-density packages. The recesses are strategically located to accommodate packages with the greatest number of stacked dies, while maintaining ease of manufacture by using standard mounting procedures for packages on the surface.
Data Source
AI summary
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.