Computer Platform Skin Temperature Management With Dynamic DC Power Allocation
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Solution Overview
Problem
Existing thermal management systems for computer systems face challenges in optimizing dc power distribution while adhering to temperature constraints, leading to inefficiencies in performance and energy usage.
Innovation Solution
A thermal management system utilizing a system on a chip (SoC) that measures temperature and power consumption data, generates a transfer function representation, and optimizes dc power assignment using a cost function to distribute power efficiently across components, incorporating thermal sensors and power monitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher throughput is pursued to improve performance, then processing speed increases, but thermal dissipation increases
Solution Approach 1:
The system dynamically adjusts DC power allocations to various components based on real-time temperature measurements and predicted thermal behavior. The power distribution is not fixed but adapts continuously to changing thermal conditions, allowing the system to optimize between performance and temperature management.
Solution Approach 2:
The system uses temperature sensors to continuously monitor actual temperatures and feeds this information back to the power management mechanism. This feedback loop enables the system to adjust power distributions based on actual thermal conditions, resolving the contradiction between high throughput and thermal dissipation.
2Temperature
If DC power distribution is optimized under temperature constraints, then temperature control improves, but system complexity increases
Solution Approach 1:
The system divides the power distribution optimization into separate manageable components: temperature sensing, thermal prediction modeling, power allocation optimization, and power distribution control. This segmentation allows each component to be designed and optimized independently while working together to achieve temperature control.
Solution Approach 2:
The system introduces an intermediary power allocation layer between the power supply and individual components. This intermediary mechanism processes temperature data and generates optimized power distributions, simplifying the overall system architecture by centralizing the control logic.
3Temperature
If thermal management system components are added to manage temperature, then temperature control improves, but device complexity increases
Solution Approach 1:
The power management mechanism performs multiple functions: it distributes power to components, monitors temperatures, predicts thermal behavior, and adjusts power allocations dynamically. By making the power management system multi-functional, the patent avoids adding separate dedicated thermal management hardware, thereby reducing overall device complexity.
Data Source
AI summary
Aspects of the disclosure are directed to a thermal management system for a computer system. In accordance with one aspect, the disclosure includes generating a transfer function representation of a relationship between a plurality of temperature data sequences and a plurality of dc power consumption data sequences; optimizing a dc power assignment to generate an optimized dc power assignment using the transfer function representation with minimization of a cost function; and distributing a plurality of dc power allocations to a plurality of components in a computer platform using the optimized dc power assignment.