Computing Host Heat Sink Airflow Guides for Dust Control
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Solution Overview
Problem
Existing server designs face challenges in achieving uniform temperature distribution among computing chips due to uneven airflow, leading to reduced heat dissipation efficiency and increased deposition of foreign matter, which affects performance and noise levels.
Innovation Solution
The implementation of heat sinks with inclined flow guiding surfaces on both sides of the computing board, guiding airflow to reduce dust deposition and maintain airflow channel smoothness while enhancing heat dissipation and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks with variable-cross-section fins (inclined or stepped surfaces) are used to even out chip temperatures, then temperature uniformity is improved, but heat dissipation area is reduced and foreign matter deposition increases
Solution Approach 1:
The patent introduces a flow guiding surface that extends in the airflow direction (first dimension) beyond the chip region, creating a three-dimensional flow control structure. This allows the airflow to be guided along the inclined surface, reducing foreign matter deposition on the heat sink end face while maintaining adequate heat dissipation area through the heat dissipation fins extending in the thickness direction (second dimension).
Solution Approach 2:
The flow guiding surface acts as an intermediary element between the airflow and the heat sink end face. It redirects the airflow path so that foreign matter is carried away from the heat sink end face by the airflow along the inclined surface, preventing deposition while still allowing effective heat transfer from the chips to the heat dissipation fins.
2Temperature
If heat sinks with variable-cross-section fins are used to even out chip temperatures, then temperature uniformity is improved, but heat dissipation area is reduced
Solution Approach 1:
The patent separates the flow control function (handled by the flow guiding surface extending in the airflow direction) from the heat dissipation function (handled by the heat dissipation fins extending in the thickness direction). This dimensional separation allows the heat dissipation area to be maintained through sufficient fin extension while the flow guiding surface controls airflow to achieve temperature uniformity.
3Area of stationary object
If conventional heat sinks are used without flow guiding surfaces, then heat dissipation area is maximized, but foreign matter deposits on heat sink end face obstructing airflow
Solution Approach 1:
The flow guiding surface serves as an intermediary that modifies the airflow path before it reaches the heat sink end face. By redirecting the airflow along the inclined surface, it prevents foreign matter from depositing on the heat sink end face, thereby maintaining airflow channel smoothness and reliability without compromising heat dissipation area.
4Device complexity
If heat sinks without flow guiding surfaces are used, then structure is simpler, but noise level increases due to turbulent airflow
Solution Approach 1:
The flow guiding surface extends in the airflow direction to create a gradual transition zone. This additional dimensional element guides the airflow smoothly over the heat sink, reducing turbulence and noise generation without requiring complex multi-component structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces dust accumulation, improves heat dissipation performance, and decreases noise levels by maintaining airflow continuity, ensuring consistent chip temperatures and system stability.
Implementation Method 1
the server is provided with a heat dissipation fan on front and rear end walls of the housing, to transfer the heat generated by the computing chips on the computing board to the external via an airflow
Implementation Method 2
the first heat sink and the second heat sink each comprise a heat dissipation panel and a plurality of heat dissipation fins
Data Source
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AI summary
The present application provides a computing host, the supercomputing unit comprises a first heat sink, a computing board and a second heat sink; the first heat sink and the second heat sink are each provided with a flow guiding surface at a portion close to the air inlet, the flow guiding surface is an inclined surface, and the inclined surface extends at least from an outer side surface of the heat dissipation fins away from the heat dissipation panel to a side close to the heat dissipation panel; the flow guiding surface is at least partially located on an outer side of the chip region close to the air inlet. The computing host can reduce the deposition of foreign matter such as dust on end faces of heat sinks, thereby improving the heat dissipation effect of the whole computing board, reducing the noise of the whole system.