Computing Power Host Heat Sinks for Dust-Resistant Cooling

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Solution Overview

Problem

Existing server designs face challenges in achieving uniform temperature distribution across computing chips due to uneven airflow, leading to reduced heat dissipation efficiency and increased deposition of foreign matter, which affects performance and noise levels.

Innovation Solution

A computing assembly with inclined flow guiding surfaces on heat sinks to guide airflow and reduce dust deposition, maintaining airflow channel smoothness while enhancing heat dissipation and reducing noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat sinks with variable-cross-section fins are used to balance temperatures, then temperature uniformity is improved, but heat dissipation area is reduced and dust deposition increases

Engineering Contradiction:

Improvetemperature uniformityVSAvoidheat dissipation area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent applies local quality by varying the fin cross-section area along the airflow direction. The fin cross-sectional area decreases from the air inlet side to the air outlet side, creating different local heat dissipation characteristics. This allows the upstream fins (closer to air inlet) to have larger area for better heat dissipation, while downstream fins have smaller area to balance temperature, achieving both temperature uniformity and maintained heat dissipation area

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs asymmetry in the fin structure by making the cross-sectional area of fins asymmetric along the airflow direction. The fins are designed with different areas at different positions rather than uniform area, with the windward surface configured as inclined or stepped surfaces. This asymmetric design optimizes both temperature distribution and heat dissipation performance

Inventive Principle:

Principle #4Asymmetry

2Temperature

If heat sinks with variable-cross-section fins are used to balance temperatures, then temperature uniformity is improved, but dust deposition on end faces increases

Engineering Contradiction:

Improvetemperature uniformityVSAvoiddust deposition

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies curvature principles by configuring the windward surface of the heat sink as inclined surfaces or stepped surfaces rather than flat perpendicular surfaces. This curved/angled design allows airflow to flow smoothly along the surface, reducing turbulence and preventing dust accumulation on the end faces of the heat sink while maintaining temperature uniformity

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Area of stationary object

If conventional heat dissipation structures are used, then heat dissipation area is maximized, but temperature distribution becomes uneven

Engineering Contradiction:

Improveheat dissipation areaVSAvoidtemperature distribution

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The patent addresses temperature distribution by applying local quality variations to the fin structure. Different sections of the fins have different cross-sectional areas tailored to the local thermal requirements. Upstream fins have larger areas where heat dissipation is more critical, while downstream fins have smaller areas, creating a non-uniform but optimized temperature distribution across all computing chips

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively balances temperatures across computing chips, improves heat dissipation performance, and reduces noise by minimizing dust accumulation and turbulence, ensuring consistent operation and extended service life.

Implementation Method 1

the fins located upstream are set to have a variable-cross-section structure... so that the area of the fins on the computing chips varies and the temperature on the computing chips is made consistent

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

the server is provided with a heat sink having fins directly above the computing chips on the computing board

Methodology Applied

Scientific EffectHeat transfer: Heat Sink

Implementation Method 3

the flow guiding surface is an inclined surface inclined with respect to a second surface of the heat dissipation panel... to guide airflow and reduce dust deposition

Methodology Applied

Scientific EffectFlow guidance: Flow Separation

Data Source

PatentUS20250311165A1Computing power host and virtual currency mining machine

Publication Date: 2025.10.02 BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD

AI summary

The present application provides a computing host, the supercomputing unit comprises a first heat sink, a computing board and a second heat sink; the first heat sink and the second heat sink are each provided with a flow guiding surface at a portion close to the air inlet, the flow guiding surface is an inclined surface, and the inclined surface extends at least from an outer side surface of the heat dissipation fins away from the heat dissipation panel to a side close to the heat dissipation panel; the flow guiding surface is at least partially located on an outer side of the chip region close to the air inlet. The computing host can reduce the deposition of foreign matter such as dust on end faces of heat sinks, thereby improving the heat dissipation effect of the whole computing board, reducing the noise of the whole system.