Computing Node Spray Cooling with Dynamic Flow Rate Control
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Solution Overview
Problem
In computing nodes, improper spray speed of liquid cooling medium can result in an inadequate refrigeration effect due to either a liquid level that is too high or too low, affecting heat dissipation efficiency.
Innovation Solution
A method to adjust the flow rate of the liquid cooling medium based on node parameters such as processor temperature, temperature increase rate, power increase rate, and pressure information to maintain an optimal liquid level height for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the spray speed of liquid cooling medium is increased, then the refrigeration effect is improved, but the liquid level in the computing node becomes too high
Solution Approach 1:
The patent implements dynamic flow rate adjustment of the liquid cooling medium based on real-time monitoring of liquid level height and processor temperature. The system transitions from static spray speed to dynamic control, where the flow rate is continuously adjusted to maintain optimal liquid level and temperature, resolving the contradiction between improving refrigeration effect and preventing excessive liquid accumulation.
Solution Approach 2:
The system employs feedback control by monitoring liquid level height and processor temperature, then adjusting the spray flow rate accordingly. The controller receives feedback from sensors and modifies the liquid cooling medium flow to maintain optimal operating conditions, preventing both insufficient cooling and excessive liquid accumulation.
2Quantity of substance
If the spray speed of liquid cooling medium is decreased, then the liquid level in the computing node is maintained, but the refrigeration effect deteriorates
Solution Approach 1:
The system dynamically adjusts spray speed based on real-time conditions rather than using a fixed low flow rate. When cooling demand increases or liquid level decreases, the system automatically increases spray speed to maintain both adequate liquid level and effective refrigeration, resolving the trade-off between these two parameters.
Solution Approach 2:
The patent changes the flow rate parameter of the liquid cooling medium based on monitored conditions such as processor temperature and liquid level height. By dynamically adjusting this parameter, the system optimizes both refrigeration effect and liquid level management, preventing deterioration of either parameter.
3Ease of operation
If the flow rate of liquid cooling medium is not adjusted, then the system operation is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The system implements self-service control where the liquid cooling medium flow rate is automatically adjusted based on monitored parameters such as processor temperature and liquid level height. The controller autonomously optimizes cooling performance without requiring manual intervention, maintaining both operational simplicity and high heat dissipation efficiency through intelligent automatic control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the precision of controlling the liquid level height, leading to better heat dissipation performance in computing nodes by optimizing the flow rate of the liquid cooling medium.
Implementation Method 1
The liquid cooling medium can absorb heat generated by the electronic component and undergo vaporization, to remove the heat generated by the electronic component
Implementation Method 2
The liquid cooling medium can absorb heat generated by the electronic component and undergo vaporization, to remove the heat generated by the electronic component
Implementation Method 3
Inside the computing node, a liquid cooling medium may be sprayed by using a nozzle
Data Source
AI summary
This application provides a flow rate control method and a computing node. The method is applied to a computing node, the computing node includes a housing, a to-be-cooled component, and a nozzle, and the to-be-cooled component and the nozzle are located in a closed cavity of the housing. The method includes: obtaining a node parameter of the computing node, where the node parameter includes at least one of the following: a processor parameter of a processor and pressure information of the closed cavity, and the to-be-cooled component includes the processor; and adjusting, based on the node parameter, a flow rate of a liquid cooling medium sprayed by the nozzle to the to-be-cooled component.