Computing Rack Architecture With Cross-Standard Liquid Cooling
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Solution Overview
Problem
Existing computing rack designs face challenges in providing sufficient cooling for densely packed computing devices, particularly in liquid cooling systems, and there is a lack of backward compatibility between EIA 19 inch and OCP 21 inch racks, leading to increased complexity and cost.
Innovation Solution
A computing rack architecture system that uses modular mounting plates to create an enclosure compatible with both EIA 19 inch and OCP 21 inch racks, incorporating power bus bars and liquid cooling manifolds that allow for blind mating of modules, reducing implementation costs and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are implemented in densely packed computing racks, then cooling efficiency is improved, but device complexity and implementation cost increase
Solution Approach 1:
The system divides the cooling function into separate liquid cooling manifolds that can be independently installed and configured. The manifolds are segmented into different modules that can be selectively deployed based on cooling requirements, allowing complex cooling functionality to be broken down into manageable, less complex components.
Solution Approach 2:
The mounting plates and manifolds are designed with universal compatibility across different rack standards (EIA 19 inch and OCP 21 inch). This multi-functionality allows the same cooling infrastructure to serve multiple rack types, reducing overall system complexity by eliminating the need for separate cooling systems for each rack standard.
2Adaptability or versatility
If different rack standards (EIA 19 inch and OCP 21 inch) are supported, then adaptability is improved, but device complexity increases
Solution Approach 1:
The mounting plates are designed with universal features that enable compatibility with both EIA 19 inch and OCP 21 inch rack standards. The same mounting plate can be installed in different rack types, providing adaptability without requiring separate mounting solutions for each standard, thereby avoiding increased complexity.
Solution Approach 2:
Instead of adapting the rack structure to accommodate different standards, the invention inverts the approach by designing modules that can be mounted on different rack standards. The mounting plates are configured to interface with various rack types, reversing the traditional adaptation direction and simplifying the system.
3Ease of operation
If standardized form factor modules are used, then ease of operation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The mounting plates include pre-configured features such as pre-drilled holes, pre-formed attachment mechanisms, and pre-positioned alignment features. These preliminary actions are built into the mounting plates during manufacturing, ensuring that modules can be easily deployed without requiring high precision during installation, while the manufacturing precision is concentrated in the standardized components themselves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables compatibility with different rack standards while reducing implementation costs and improving cooling efficiency through standardized form factor electronic modules, facilitating easier deployment and removal of modules.
Implementation Method 1
liquid cooling manifolds that allow for blind mating of modules
Implementation Method 2
liquid cooling systems, such as liquid immersion cooling, or liquid cooling provided by cold plates
Data Source
AI summary
Embodiments of the present disclosure provide a computing rack architecture system and method in which standardized form factor electronic modules may be compatible with different types of computing racks. According to one embodiment, a computing rack architecture system and method includes a first plate mounted to a computing rack, and a second plate mounted to the computing rack at a specified distance from the first plate. The first plate, second plate, and sides of the computing rack comprise an enclosure that is configured to house a plurality of modules of an Information Handling System (IHS).