Semiconductor Package Concave Heat Dissipation Structure for Chip Cooling

The patent transitions from planar heat dissipation to three-dimensional heat dissipation by forming vertical heat dissipation channels through the substrate. Heat dissipation structures extend from the front surface through the substrate to the back surface, creating multiple thermal pathways in the vertical dimension that complement the horizontal heat spreader, thereby increasing overall heat dissipation capacity without limiting device miniaturization

The patent introduces intermediary thermal management components including heat spreaders positioned between semiconductor devices and the substrate, and heat dissipation structures embedded in the substrate. These intermediary elements facilitate efficient thermal transfer from heat-generating devices to the surrounding environment, mediating the thermal relationship between compact devices and the external heat sink

The patent merges multiple thermal management functions into an integrated substrate structure. The substrate simultaneously serves as a mechanical support, an electrical isolation layer, and a heat dissipation pathway. Heat spreaders and heat dissipation structures are integrated into the substrate, creating a unified thermal management system that reduces interfacial thermal resistance and improves heat transfer efficiency

The patent employs composite material structures combining different materials with complementary thermal properties. Heat spreaders may use high thermal conductivity materials while the substrate provides both mechanical support and thermal pathways. This composite approach optimizes thermal performance while maintaining electrical isolation and mechanical strength, reducing thermal resistance at material interfaces