Concave Probe Electrode Structure for Variable-Height Chip Contact
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Solution Overview
Problem
Existing probe cards used in semiconductor testing face challenges in effectively contacting semiconductor devices with varying heights and preventing damage due to excessive pressure, leading to reduced service life and increased replacement frequency.
Innovation Solution
The inspection device employs a contact electrode with a concave surface and a buffer region, allowing for flexible contact with semiconductor devices, reducing pressure and minimizing damage by conforming to varying heights and reducing sliding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid probe structure is used to ensure stable electrical contact, then electrical connectivity is improved, but the probe cannot adapt to varying heights of semiconductor devices and causes damage due to excessive pressure
Solution Approach 1:
The probe card incorporates an elastic layer that changes its physical state from rigid to flexible under compression, allowing the contact surface to deform and adapt to varying device heights while maintaining electrical connectivity and reducing excessive pressure on semiconductor devices
Solution Approach 2:
The elastic layer acts as a pre-designed cushioning element between the rigid support structure and the semiconductor device, absorbing excess pressure before it can reach the device, thereby preventing damage while ensuring stable electrical contact
2Ease of manufacture
If a flat contact surface is used for simplicity, then manufacturing is easier, but contact area is reduced and resistance increases
Solution Approach 1:
The contact surface is designed with a concave curved shape that conforms to the convex surface of semiconductor devices, increasing the actual contact area and reducing contact resistance while maintaining manufacturing feasibility through standard molding or etching processes
3Adaptability or versatility
If a flexible contact structure is used to adapt to varying heights, then adaptability is improved, but structural stability deteriorates
Solution Approach 1:
The probe card structure is divided into distinct functional layers: a rigid support layer providing structural stability, an intermediate elastic layer providing flexibility and height adaptation, and a contact layer providing electrical connectivity. This segmentation allows each layer to perform its specific function without compromising the overall structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The concave contact electrode increases contact area, reduces resistance, and extends the service life of the inspection device while preventing damage to semiconductor components, thereby improving production yield and lowering replacement costs.
Implementation Method 1
an elastic layer, wherein a lower surface of the support layer is connected to the upper surface of the elastic layer
Data Source
AI summary
An inspection device includes a carrier, an input electrode, a metal layer and a contact electrode. The input electrode is disposed on the carrier. The metal layer includes a fixed portion and an extending portion. The fixed portion is disposed on the carrier, the fixed portion has one end connected to the input electrode, and has another end that extends in a direction far away from the carrier. The extending portion is electrically connected to the another end of the fixed portion, the extending portion is separated from the carrier by a spacing to form a buffer region. The contact electrode is disposed on the extending portion of the metal layer, and electrically connected to the extending portion of the metal layer. The contact electrode has a concave surface facing away from the carrier.