Conductive Film Formation via Concave Substrate Reference
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Solution Overview
Problem
Existing semiconductor manufacturing methods face challenges in forming conductive films with high precision due to errors in mask opening size and placement, leading to inaccuracies in film formation on substrates.
Innovation Solution
A method involving a mask with an opening placed over a concave portion on the substrate, where the end of the mask's opening is positioned above the concave area, allowing the conductive film to be grown within the concave region while avoiding errors in mask placement and size, ensuring precise film formation by determining the film's area based on the concave portion's edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is placed on the top face of a substrate to grow a conductive film, then a patterned conductive film can be formed, but manufacturing errors occur in the size of the mask opening and placing position, reducing formation precision
Solution Approach 1:
The patent introduces a concave portion on the substrate surface as an intermediary reference feature between the mask and the final conductive film pattern. This concave portion serves as a physical mediator that defines the boundary of film formation, allowing the mask to be positioned relative to it rather than directly to the desired film edge. The conductive film is grown to extend from the inner peripheral end of the concave portion to its outer peripheral end, making the concave portion the determining factor for film dimensions rather than mask dimensions or placement accuracy.
Solution Approach 2:
The concave portion is formed on the substrate surface before mask placement and conductive film growth. This preliminary structuring creates a pre-defined reference framework that guides subsequent processing steps. By establishing the concave portion first, the system pre-determines the boundaries within which the conductive film will be formed, eliminating the need for high-precision mask placement and opening fabrication that would otherwise be required to achieve the same dimensional accuracy.
2Manufacturing precision
If the mask opening size and placement are controlled to high precision, then conductive film can be formed accurately, but manufacturing complexity and cost increase
Solution Approach 1:
The concave portion acts as an intermediary reference that simplifies the mask requirements. Instead of requiring the mask to precisely define the film boundaries through high-precision opening fabrication and placement, the mask only needs to cover the area beyond the concave portion. The concave portion itself becomes the precision element, which can be formed with standard semiconductor fabrication techniques, thereby reducing overall process complexity.
Solution Approach 2:
The concave portion on the substrate surface serves as a self-contained reference feature that automatically defines the film formation boundaries. The substrate structure itself provides the reference framework, eliminating the need for external precision alignment systems or complex mask designs. The system uses its own substrate topography to guide the film formation process, reducing dependence on high-precision external tools and procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of conductive films with high precision, unaffected by mask placement errors, and reduces stress during brazing, enhancing the accuracy and reliability of semiconductor device manufacturing.
Implementation Method 1
growing a conductive film on part of the top face of the substrate through the mask
Data Source
AI summary
A manufacturing method of a semiconductor device includes placing a mask having an opening on an external region of a top face of a substrate to locate an end portion of the opening of the mask just above a concave portion formed on the top face of the substrate, the external region being located outside the concave portion. The manufacturing method further includes: growing a conductive film on part of the top face of the substrate through the mask after the mask is placed on the substrate, the part of the top face containing the concave portion; and removing the mask from the substrate after the conductive film is grown.