Concentric Bond Rings for Hermetic Substrate Sealing
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Solution Overview
Problem
In semiconductor technology, bonding two substrates to maintain a hermetic cavity is challenging due to chemical and mechanical stress, which can cause degradation or loss of hermeticity, especially when a single bond ring is used, leading to issues like corrosion and cracking.
Innovation Solution
The implementation of a second bond ring made of organic material, such as polyimide, surrounding the first bond ring to provide additional mechanical strength and protection, along with eutectic bonding processes between the substrates to form multiple bond rings that encircle the hermetic cavity, enhancing structural integrity and hermeticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single bond ring is used to bond two substrates, then the device structure is simple, but the bond ring degrades under chemical and mechanical stress causing corrosion and cracking
Solution Approach 1:
The bond ring is divided into multiple concentric rings (first bond ring and second bond ring) instead of using a single bond ring. The first bond ring provides hermetic sealing while the second bond ring provides mechanical strength and protects against corrosion and cracking during processing
Solution Approach 2:
Different materials are used for the first and second bond rings to optimize their respective functions. The first bond ring uses materials suitable for hermetic sealing, while the second bond ring uses materials that provide mechanical strength and resistance to chemical and mechanical stress
2Ease of manufacture
If a single bond ring is used to maintain hermetic cavity, then the manufacturing process is simple, but hermeticity is lost due to degradation under stress
Solution Approach 1:
The bonding process is segmented into multiple bonding operations to form separate first and second bond rings. This segmentation allows each bond ring to be optimized for its specific function (hermeticity vs. mechanical protection) while maintaining a manageable manufacturing process
3Reliability
If additional bond rings are added to protect from stress, then bond ring integrity is improved, but device complexity increases
Solution Approach 1:
The first and second bond rings are arranged in a nested configuration where the second bond ring surrounds the first bond ring. This nested structure provides enhanced protection and integrity while maintaining a compact and relatively simple device geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of hermeticity loss and cracking during processing, maintaining the integrity of the bond and hermetic cavity by providing additional mechanical strength and shielding the inner bond ring from chemical and physical impacts.
Implementation Method 1
The first substrate is bonded to the second substrate using a eutectic bonding process
Data Source
AI summary
The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.