Concentric Multiwall Vias for High Signal Density
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Solution Overview
Problem
Conventional vias in multilayer substrates occupy significant space, limiting the increase in electrical signal density without proportional expansion in substrate size, especially in dense package designs with many signal connections.
Innovation Solution
A multiwall via structure is introduced, comprising an outer via and an inner via within the outer via, separated by a dielectric layer, to create multiple signal paths between conductive layers, allowing for increased signal density without increasing the occupied space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional single-path vias are used to connect conductive layers, then the structure is simple and easy to manufacture, but the signal density is limited and substrate size must increase to accommodate more connections
Solution Approach 1:
The patent implements a via-within-via structure where an inner via is nested inside an outer via, both connecting the same pair of conductive layers. This nesting arrangement allows multiple signal paths to occupy the same spatial footprint, effectively doubling the signal density without increasing the substrate area required for via connections.
Solution Approach 2:
The invention transitions from a single signal path through a via to multiple concentric signal paths by utilizing the radial dimension within the via structure. By adding an inner via surrounded by a dielectric layer within the outer via, the patent creates additional signal carrying capacity in the radial direction without expanding the vertical or horizontal footprint.
2Quantity of substance
If multiple vias are placed close together to increase signal density, then more connections can be made, but the capture pads and via structures occupy excessive space
Solution Approach 1:
By nesting an inner via within an outer via, the patent allows two separate signal connections to share the same capture pad and occupy the same spatial location on the substrate surface. This eliminates the need for additional capture pads and via structures that would otherwise be required to achieve the same number of connections, thereby reducing the total area occupied.
3Quantity of substance
If concentric vias with dielectric layers are implemented to create multiple signal paths, then signal density increases, but the manufacturing process becomes more complex
Solution Approach 1:
The via structure is segmented into distinct functional components: an outer via, an inner via, and a dielectric layer separating them. This segmentation allows each component to be manufactured and controlled independently, with the dielectric layer providing electrical isolation between the concentric conductive paths while maintaining structural integrity.
Data Source
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AI summary
A multiwall via structure in an electronic substrate having multiple conductive layers. The multiwall via structure includes an outer via coupled to a pair of the conductive layers, an inner via within the outer via and coupled to the same pair of conductive layers, and a dielectric layer between the inner and outer vias. In various embodiments, the pair of conductive layers can be inner conductive layers or outer conductive layers of the electronic substrate. In other embodiments, a method of preparing a multiwall via structure is provided.