Concentric Ring On-Chip Heater for Uniform Sensor Temperature
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Solution Overview
Problem
On-chip heaters for sensors face challenges in achieving uniform temperature distribution, with rectangular configurations experiencing center-to-edge temperature gradients and circular configurations requiring larger operating voltages and suffering from current and power distribution issues.
Innovation Solution
A concentric rings configuration for on-chip heaters, where the spacing between heating elements is determined using polynomial compensation to achieve uniform temperature distribution, and electrical connections are made to ensure equal resistance across each group of connected heating elements, reducing operating voltage and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rectangular heater configuration is used, then manufacturing is simple, but temperature distribution becomes non-uniform with center-to-edge gradients
Solution Approach 1:
The heater is divided into multiple discrete heating elements arranged in concentric rings rather than a single continuous rectangular structure. This segmentation allows independent control and optimization of each ring's resistance and heating characteristics to achieve uniform temperature distribution across the substrate.
Solution Approach 2:
The heater transitions from a rectangular geometry to concentric circular rings. This curved geometry naturally distributes current and heat more uniformly across the substrate surface, eliminating the center-to-edge temperature gradients inherent in rectangular configurations.
2Temperature
If circular heater configuration is used, then temperature uniformity improves, but operating voltage increases and power distribution becomes problematic
Solution Approach 1:
Each concentric heating ring is designed with locally optimized resistance characteristics. The resistance per unit length varies with radius to compensate for the increasing circumference, ensuring uniform power density and temperature distribution while maintaining appropriate operating voltage levels.
Solution Approach 2:
The electrical resistance parameter is systematically varied across different heating rings. Inner rings have higher resistance per unit length than outer rings, creating a gradient that balances the increasing path length and maintains uniform current density and power consumption across all rings.
3Ease of manufacture
If uniform spacing between heating elements is used, then manufacturing is simple, but temperature uniformity deteriorates due to varying path lengths
Solution Approach 1:
The spacing between concentric heating rings is intentionally made non-uniform. The radial distance between adjacent rings varies to compensate for the increasing circumference at larger radii, ensuring that each ring contributes equally to the overall temperature uniformity despite having different path lengths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The concentric rings configuration achieves temperature uniformity within 1.5°C or less across the heater surface, improving thermal management and reducing power requirements while maintaining uniform current density.
Implementation Method 1
A concentric rings configuration for on-chip heaters, where the spacing between heating elements is determined using polynomial compensation to achieve uniform temperature distribution
Data Source
AI summary
An on-chip heater in a concentric rings configuration having non-uniform spacing between heating elements provides improved radial temperature uniformity and low power consumption compared to circular or square heating elements. On-chip heaters are suitable for integration and use with on-chip sensors that require tight temperature control.