Concentric Shaft Transfer Apparatus for Semiconductor Substrates
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Solution Overview
Problem
Conventional wafer transfer systems in semiconductor processing are inadequate for efficiently handling substrates in cluster tool environments, leading to reduced throughput due to inefficient transfer speeds and potential thermal non-uniformity and particle contamination.
Innovation Solution
A transfer apparatus with a central hub and concentric shafts, featuring independently rotatable arms and aligners, allows for simultaneous or individual transfer of substrates between multiple supports within a transfer region, enabling faster and more precise substrate handling while maintaining a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional wafer transfer systems are used, then the system structure is simple, but the substrate transfer speed is slow and throughput is reduced
Solution Approach 1:
The transfer system is segmented into multiple independent arms (first arm, second arm, third arm, fourth arm) that can operate simultaneously to transfer different substrates. Each arm is independently controllable, allowing parallel operations that increase overall transfer speed without requiring a complete system redesign
Solution Approach 2:
Multiple arms are merged into a single integrated transfer system sharing common support structures and control mechanisms. The arms share common shafts and mounting structures, reducing overall system complexity while enabling simultaneous substrate transfers through coordinated arm movements
2Loss of time
If conventional transfer systems are used, then the device complexity is low, but the queue time between processing chambers increases
Solution Approach 1:
The multiple arms are configured to perform continuous substrate transfer operations without idle waiting periods. While one arm transfers a substrate from chamber A to chamber B, other arms simultaneously perform transfers between different chamber pairs, eliminating queue times and maintaining continuous productive action across all transfer operations
Solution Approach 2:
The arms are designed with dynamic positioning capabilities, allowing them to move between different transfer positions and adjust their motion paths based on real-time processing requirements. This dynamic flexibility enables optimal transfer routing that minimizes queue times while adapting to varying production demands
3Object-affected harmful factors
If conventional transfer systems are used, then the system is simple to operate, but thermal non-uniformity and particle contamination occur
Solution Approach 1:
The arms are designed to maintain consistent positioning accuracy and transfer heights across all transfer locations. By ensuring that all arms operate at equivalent positional precision and maintain uniform distances from substrate processing surfaces, thermal non-uniformity is minimized while particle contamination is reduced through consistent, controlled transfer paths
Solution Approach 2:
The system replaces manual or simple mechanical transfer mechanisms with automated, precisely controlled arm movements. This substitution enables more accurate and repeatable transfer operations that reduce variability in thermal exposure and minimize the risk of particle generation compared to conventional mechanical transfer systems
Data Source
AI summary
Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.