Concurrent Substrate Transport Mechanisms for High-Throughput Indexer
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Solution Overview
Problem
Substrate processing apparatuses face challenges in enhancing throughput due to inefficient transport mechanisms, which hinder the efficient processing of substrates such as semiconductor substrates, liquid crystal display substrates, and optical disks.
Innovation Solution
The apparatus incorporates an indexer block with a container platform and concurrent first and second transport mechanisms that simultaneously transport substrates between storage containers and processing blocks, allowing for efficient processing and storage, and includes additional features like multiple holders and platforms to enhance transport efficiency and simplify operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single transport mechanism is used to transport substrates between storage container and processing block, then the device complexity is reduced, but the productivity and throughput of the substrate processing apparatus deteriorates
Solution Approach 1:
The transport function is segmented into multiple independent transport mechanisms (first transport mechanism and second transport mechanism) that operate concurrently. Each mechanism handles specific substrate transport tasks, allowing parallel operations to increase throughput without requiring a single complex mechanism
Solution Approach 2:
The first and second transport mechanisms are designed with multi-functionality, where each mechanism can perform multiple operations including transporting substrates to and from the processing block, holding multiple substrates simultaneously, and coordinating with storage containers. This universal design allows concurrent operations that improve productivity
2Productivity
If multiple transport mechanisms are added to improve substrate transport efficiency, then the productivity increases, but the installation space and device footprint increase
Solution Approach 1:
The transport mechanisms utilize vertical space and three-dimensional positioning within the indexer block rather than only horizontal expansion. Substrates are transported along multiple spatial paths including vertical and diagonal movements, allowing multiple mechanisms to coexist in a compact footprint by utilizing different spatial dimensions
Solution Approach 2:
The first and second transport mechanisms are nested within the indexer block structure, with their components arranged in a compact, space-efficient configuration. The mechanisms share common structural elements and operate within the same vertical envelope, reducing the overall installation footprint while maintaining concurrent transport capabilities
Data Source
AI summary
A substrate processing apparatus includes an indexer block, a first processing block, a second processing block, and an interface block. The indexer block includes a pair of carrier platforms and a transport section. A carrier storing a plurality of substrates in multiple stages is placed in each of the carrier platforms. The transport section includes transport mechanisms. The transport mechanisms concurrently transport the substrates.