Condensation Die Bonding Agent for LED Electrical Connection Reliability

Solution Overview

Problem

The existing die bonding agents for LED light emitting devices often result in poor electrical connections due to the vaporization of siloxane with SiH groups, which forms insulation layers on the gold-covered connection surfaces during heat treatment, leading to connectivity issues.

Innovation Solution

A condensation reaction-type die bonding agent is developed, comprising a polysilsesquioxane solid and liquid with trisiloxy units and a condensation reaction catalyst, which minimizes the vaporization of siloxane with SiH groups, thereby preventing the formation of insulation layers and ensuring reliable electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an addition reaction-type die bonding agent is used to bond the mounting substrate and LED device, then the bonding agent can be cured by addition reaction to provide bondability, but siloxane with SiH groups vaporizes during heat treatment and forms insulation layers on the gold-covered connection surfaces, resulting in poor electrical connection

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidinsulation layer formation on connection surfaces

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the chemical reaction mechanism from addition reaction to condensation reaction. The condensation reaction-type die bonding agent uses different chemical components that react through condensation rather than addition, fundamentally altering the reaction parameters to prevent SiH group vaporization and insulation layer formation while maintaining bonding functionality

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent converts the harmful vaporization of siloxane into a beneficial process by using condensation reaction that produces water or alcohol as byproducts instead of volatile siloxane. The reaction formula shows that low molecular weight byproducts (water or alcohol) are formed instead of harmful siloxane vapor, eliminating the insulation layer problem while maintaining the curing function

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If heat treatment is performed to cure the addition reaction-type die bonding agent, then the bonding agent achieves curing and bondability, but the siloxane vaporizes during heat treatment and forms insulation layers on the connection surfaces

Engineering Contradiction:

ImprovebondabilityVSAvoidheat treatment temperature effects

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent changes the chemical reaction mechanism from addition reaction to condensation reaction. The condensation reaction-type die bonding agent uses different chemical components that react through condensation rather than addition, fundamentally altering the reaction parameters to prevent SiH group vaporization and insulation layer formation while maintaining bonding functionality

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent converts the harmful vaporization of siloxane into a beneficial process by using condensation reaction that produces water or alcohol as byproducts instead of volatile siloxane. The reaction formula shows that low molecular weight byproducts (water or alcohol) are formed instead of harmful siloxane vapor, eliminating the insulation layer problem while maintaining the curing function

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the likelihood of poor electrical connections by preventing insulation layer formation, enhancing the reliability and performance of the LED light emitting devices during the bonding process.

Implementation Method 1

a condensation reaction-type die bonding agent for bonding an LED device

Methodology Applied

Scientific EffectCondensation reaction:

Implementation Method 2

having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (TB) expressed by R2SiO3/2

Methodology Applied

Scientific EffectCondensation reaction:

Data Source

PatentUS10461232B2Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same

Publication Date: 2019.10.29 CITIZEN WATCH CO LTD

AI summary

A condensation reaction-type die bonding agent has little liability of poor electrical connection at the electrodes. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, where the die bonding agent includes (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (TA) expressed by R1SiO3/2 where, R1 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (TB) expressed by R2SiO3/2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR2 where, R2 indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst.