Condenser Header Liquid-Level Valving for Valve-Free Cooling

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Solution Overview

Problem

Current split condenser systems rely on valves and flow control devices, which increase costs, complexity, and potential failure points.

Innovation Solution

A closed loop cooling system uses a liquid level in a header to control refrigerant flow, eliminating the need for valves by blocking vapor communication with condensers, thereby simplifying the system and minimizing failure points.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If valves and flow control devices are used to stop or limit refrigerant flow into condensers, then cooling capacity control is achieved, but device complexity and cost increase

Engineering Contradiction:
Improvecooling capacity controlVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent removes valves and flow control devices from the system entirely, extracting the problematic components that caused complexity and potential failure points while maintaining cooling capacity control through alternative means (liquid level control in the header)

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The system uses the refrigerant liquid itself to control flow distribution automatically based on liquid level in the header, eliminating the need for external control devices. The liquid level naturally regulates refrigerant flow to different condensers without requiring valves or flow control mechanisms

Inventive Principle:
Principle #25Self-service

2Adaptability or versatility

If valves and flow control devices are installed to manage refrigerant flow, then cooling distribution is controlled, but potential failure points and leaks increase

Engineering Contradiction:
Improvecooling distribution controlVSAvoidsystem reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

By removing valves and flow control devices from the system, the patent eliminates the components that create potential failure points and leak paths, thereby improving system reliability while maintaining cooling distribution control through liquid level management

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If valves and flow control devices are used to regulate refrigerant flow, then cooling capacity is controlled, but manufacturing cost increases

Engineering Contradiction:
Improvecooling capacity controlVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent eliminates valves and flow control devices from the system, removing expensive components that increase manufacturing costs while maintaining cooling capacity control through a simpler liquid level-based flow distribution mechanism

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach efficiently controls cooling capacity, reduces costs, and minimizes potential leaks by using a liquid level in a header to manage refrigerant flow, enhancing system reliability.

Implementation Method 1

using a liquid level in a header to block off vapor communication with a condenser

Methodology Applied
Scientific EffectLiquid level blocking: Physical Containment

Implementation Method 2

one outlet can be located on the header at a lower elevation or position than the other outlet

Methodology Applied
Scientific EffectGravity-driven flow: Gravitation

Data Source

PatentEP4671641A1Liquid valving condenser header
Publication Date: 2025.12.31 VERTIV CORP
  • EP4671641A1 patent drawingFigure 1
  • EP4671641A1 patent drawingFigure 2
  • EP4671641A1 patent drawingFigure 3

AI summary

A closed loop cooling system can include a first condenser having a first inlet to receive a cooling media for removing heat from a heat source, a second condenser having a second inlet to receive the cooling media, and a header for being plumbed between a heat source and the condensers. The second condenser can be plumbed in parallel with the first condenser. The header can receive the cooling media from the heat source and selectively distribute the cooling media to either or both of the condensers. The header can have a first outlet fluidically coupled to the first inlet and a second outlet fluidically coupled to the second inlet. The second outlet can be located on the header at a lower elevation than the first outlet.