Semiconductor Package Condenser Structure for Lightweight EMI Shielding
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Solution Overview
Problem
Current semiconductor packages face challenges in effectively shielding semiconductor chips from electromagnetic interference (EMI) as electronic devices become lighter and more performance-oriented.
Innovation Solution
The semiconductor package incorporates a condenser structure with a first conductive layer, a dielectric layer, and a second conductive layer, stacked on the package body to provide EMI shielding, along with a base substrate and connection bumps for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a semiconductor package is designed to be lightweight and high-performance, then device performance and portability are improved, but the ability to shield semiconductor chips from electromagnetic interference (EMI) deteriorates
Solution Approach 1:
The patent implements nested EMI shielding structures where an inner shielding layer is placed within the encapsulant close to the semiconductor chip, and an outer shielding layer is positioned on the package substrate. This nested configuration provides comprehensive EMI protection while minimizing the additional weight by optimizing the placement and thickness of each shielding layer.
Solution Approach 2:
The patent employs composite EMI shielding structures combining different conductive materials and configurations. The inner shielding layer may use conductive encapsulant or thin conductive coatings, while the outer shielding layer uses conductive traces on the package substrate. This composite approach achieves effective EMI shielding with minimized weight by selecting materials with optimal conductivity-to-weight ratios.
2Object-affected harmful factors
If EMI shielding structures are added to the semiconductor package, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The patent merges EMI shielding functions with existing package components. The encapsulant is combined with conductive materials to form an integrated inner shielding layer, and the package substrate is designed with integrated conductive traces serving as the outer shielding layer. This merging approach provides EMI protection without adding separate, complex shielding components.
Solution Approach 2:
The patent makes existing components multi-functional: the encapsulant not only protects the semiconductor chip physically but also serves as part of the EMI shielding structure through conductive additives or coatings. The package substrate not only provides mechanical support and electrical interconnection but also functions as an EMI shielding layer through its conductive trace patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the package's ability to shield against EMI, ensuring reliable performance of semiconductor chips in lightweight, high-performance electronic devices.
Implementation Method 1
A semiconductor package with an EMI shielding structure that is introduced to the outside of the semiconductor package is currently under development
Data Source
AI summary
A semiconductor package includes: a package substrate including upper pads, lower pads, and a first wiring layer electrically connecting first upper pads of the upper pads to first lower pads of the lower pads, respectively; a semiconductor chip disposed on the package substrate and electrically connected to the first upper pads; an encapsulant covering the semiconductor chip and at least a portion of the package substrate; a first conductive layer covering at least a portion of each of the encapsulant and the package substrate, wherein the first conductive layer is configured to apply a first voltage; a dielectric layer stacked on the first conductive layer; and a second conductive layer stacked on the dielectric layer, wherein the second conductive layer is configured to apply a second voltage.