Stacked-Plate Condenser with Through-Pipe Accumulator Routing

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Solution Overview

Problem

Conventional condensers for air conditioning systems in motor vehicles have complex structures and high production costs due to the integration of condensers, collectors, and supercoolers, making them expensive and difficult to manufacture.

Innovation Solution

A condenser with a stacked disk design featuring a first flow channel for refrigerant and a second flow channel for coolant, where the refrigerant is transferred through a collector that is integrated within the condenser, allowing for a simple and compact construction using predominantly identical disk elements, with fluid connections formed by tubes passing through the disk elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If condensers, collectors and supercoolers are integrated into a single unit, then refrigerant volume stability and complete subcooling are improved, but device complexity and production cost increase

Engineering Contradiction:
Improverefrigerant volume stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The condenser is divided into multiple flow channels (first flow channel for refrigerant, second flow channel for coolant) using stacked plate construction. This segmentation allows the refrigerant to flow through distinct paths including the collector, ensuring complete subcooling while maintaining a modular, manageable structure that reduces manufacturing complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The collector is designed to perform multiple functions: it stores refrigerant, dries the refrigerant, and filters the refrigerant. By integrating these functions into a single component within the stacked plate structure, the patent achieves refrigerant volume stability and complete subcooling without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If condensers, collectors and supercoolers are integrated into a single unit, then complete subcooling is ensured, but manufacturing cost increases

Engineering Contradiction:
Improvecomplete subcoolingVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The stacked plate construction divides the condenser into multiple flow channels using individual plates. This segmentation enables the refrigerant to flow through the collector in a controlled manner, ensuring complete subcooling. The modular plate design also simplifies manufacturing compared to traditional integrated units, as plates can be produced separately and assembled.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses parameter changes in the flow channel design, including the arrangement of partition walls and the configuration of the collector within the stacked plates, to optimize refrigerant flow and heat transfer. These parameter optimizations ensure complete subcooling while maintaining manufacturing efficiency.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If multiple different components are used for condenser, collector and supercooler, then functional performance is improved, but device complexity increases

Engineering Contradiction:
Improvefunctional performanceVSAvoidnumber of different components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The collector is designed as a multi-functional component that simultaneously stores refrigerant, dries the refrigerant, and filters the refrigerant. This universal design reduces the number of different components needed while maintaining high functional performance, as the collector performs multiple essential functions within the stacked plate structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the functions of the condenser, collector, and supercooler into a single integrated unit using stacked plate construction. By combining these components into one structure with multiple flow channels, the patent reduces device complexity while preserving the functional performance of each individual component.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If traditional integrated design is used, then refrigerant flow control is improved, but manufacturing simplicity decreases

Engineering Contradiction:
Improverefrigerant flow controlVSAvoidmanufacturing simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The stacked plate construction segments the refrigerant flow into distinct channels using individual plates and partition walls. This segmentation provides precise control over refrigerant flow paths, ensuring the refrigerant passes through the collector for complete subcooling. The modular plate design also simplifies manufacturing, as plates can be produced separately and assembled using standard techniques.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a cost-effective and efficient condenser that ensures complete subcooling of the refrigerant, maintains refrigerant volume stability, and integrates drying and filtering functions, reducing production complexity and costs.

Implementation Method 1

a first flow channel for a refrigerant and having a second flow channel for a coolant... a first number of channels forming the first flow channel for a refrigerant and a second number of channels forming the second flow channel for a coolant

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a first area for heat removal and condensation of the vaporous refrigerant

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

a second area for supercooling the condensed refrigerant... After flowing through the collector, the refrigerant is returned to the condenser and subcooled below the condensation temperature

Methodology Applied
Scientific EffectHeat removal: Conduction (thermal)

Data Source

PatentEP2997318B1Condenser
Publication Date: 2019.02.06 MAHLE INT GMBH
  • EP2997318B1 patent drawingFigure 1~2
  • EP2997318B1 patent drawingFigure 3~4
  • EP2997318B1 patent drawingFigure 5~6

AI summary

The invention relates to a condenser (1, 1a, 70, 80, 100) of stacked-plate design, having a first flow duct (25, 25a, 80, 87) for a refrigerant and having a second flow duct (28, 26a, 32, 42, 52, 85) for a coolant, wherein a multiplicity of disk elements is provided, said disk elements, stacked one on top of the other, forming mutually adjacent ducts between the disk elements, wherein a first number of the ducts is assigned to the first flow duct (25, 25a, 60, 87) and a second number of the ducts is assigned to the second flow duct (26, 26a, 32, 42, 52, 85), wherein the first flow duct (25, 25a, 60, 87) has a first region (3, 72, 81) for extraction of heat from and condensation of the vaporous refrigerant and has a second region (4, 71, 82) for supercooling of the condensed refrigerant, having an accumulator (2) for storing a refrigerant, wherein a refrigerant passage from the first region (3, 72, 81) to the second region (4, 71, 82) leads through the accumulator (2), wherein the accumulator (2) is in fluid communication with the first region (3, 72, 81) by way of a first connection element which forms a first fluid connection of the accumulator (2), wherein the accumulator (2) is in fluid communication with the second region (4, 71, 82) by way of a second connection element which forms a second fluid connection of the accumulator (2), and wherein the first connection element and/or the second connection element are/is formed by a pipe (5, 101, 125, 140, 150) which extends through a number of disk elements through openings in the disk elements.