Conducting Belt for Anode Holder in Semiconductor Plating
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Solution Overview
Problem
Existing plating apparatuses face challenges in reliably supplying electric current to larger anodes and efficiently replacing them, particularly due to the weight and size of the anodes, which hinder the formation of finer interconnections and increased throughput in semiconductor wafer processing.
Innovation Solution
A conducting belt that contacts and holds the outer circumferential edge of a disk-shaped anode, allowing for reliable electric current supply without positional alignment and facilitating easy replacement by securing the anode with a fastener system, integrated with an anode holder that includes a mask and transfer mechanism for automated handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plate-like anode is used in vertical-immersion plating, then in-plane uniformity is improved, but anode replacement becomes difficult due to weight and size
Solution Approach 1:
The anode is divided into multiple segment electrodes that can be independently replaced. Each segment is smaller and lighter, allowing easy manual handling and replacement without affecting the overall plating uniformity when segments are arranged in the holder.
Solution Approach 2:
The anode holder is designed with movable and replaceable segment electrodes rather than a fixed rigid structure. This dynamic design allows the anode configuration to be adjusted and replaced easily while maintaining the parallel arrangement needed for uniform plating.
2Device complexity
If manual anode replacement is attempted, then device complexity is reduced, but productivity decreases due to time-consuming replacement process
Solution Approach 1:
Multiple anode segments are pre-prepared and can be quickly swapped with the used anode segments. The segmented design allows for rapid replacement without complex mechanisms, improving productivity while keeping the device simple.
3Reliability
If contact area between conducting belt and anode is increased, then electric current supply reliability is improved, but device complexity increases
Solution Approach 1:
The conducting belt contacts the anode segments at their peripheral edges rather than attempting to cover large surface areas. This edge-contact approach in a different dimensional configuration achieves reliable electrical connection while keeping the belt design simple and the contact area sufficient for current supply.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent electric current supply, reduces contact resistance, simplifies anode replacement, and enhances operational efficiency by automating the process, ensuring safety and precision in handling and positioning within the plating apparatus.
Implementation Method 1
a belt (1) capable of contacting an outer circumferential edge of the anode (5) and holding the anode (5)... for supplying an electric current to an anode (5)
Implementation Method 2
an anode mask (13) mounted on the anode holder base (11) for covering a portion of a front surface of the anode (5)
Implementation Method 3
a surface W1 of the substrate W which is exposed from the substrate holder 104 is electroplated
Data Source
AI summary
A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are vertically disposed so as to face each other in a plating tank of a plating apparatus. The conducting belt includes a belt capable of contacting an outer circumferential edge of the anode and holding the anode.