Conducting Line Repair via CVD Copper Deposition
Solution Overview
Problem
The increasing density and thinness of conducting lines on semiconductor IC chips and PCBs make it difficult for operators to visually detect and repair broken lines, complicating the soldering process.
Innovation Solution
A device with a substrate, nozzle, and microscope is used to detect broken conducting lines, followed by a chemical vapor deposition method to form a copper layer at the broken position, facilitating precise repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conducting lines are made thinner and narrower to increase density, then more lines can be placed in a given area, but visual detection and repair by operators becomes difficult
Solution Approach 1:
The patent replaces the manual visual inspection and soldering process with an automated system using a microscope for detection and a nozzle for material deposition. This substitution of mechanical/manual operations with automated equipment enables precise repair of thin conducting lines that are difficult to detect visually.
2Reliability
If copper is used instead of aluminum to maintain low resistance in thinner lines, then inner resistance is reduced, but the repair process becomes more complex
Solution Approach 1:
The patent extracts only the necessary copper material to the broken position through a nozzle, rather than requiring complete replacement or complex processing. This localized material deposition simplifies the repair process while maintaining the low resistance properties of copper.
3Ease of operation
If manual soldering is used for repair, then the process is simple, but precision and efficiency decrease for thin lines
Solution Approach 1:
The system performs automated detection and repair without requiring manual intervention. The microscope automatically detects broken lines, and the nozzle automatically deposits material, enabling the system to serve itself and eliminating the need for operator skill while improving efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables accurate detection and repair of thin conducting lines by forming a copper layer at the broken point, improving the efficiency and precision of the repair process without increasing inner resistance.
Implementation Method 1
forming a copper layer at the broken position on the substrate
Data Source
AI summary
An exemplary repairing method includes providing a substrate having a plurality of conducting lines; detecting a broken position of one of the conducting lines; switching on a nozzle; and forming a copper layer at the broken position on the substrate. The repairing method of the present invention employing a repairing device for performing a chemical vapor deposition (CVD) method to forming the copper layer at a position of the broken defect of one of the conducting lines.