Conduction Cooled Module With Integrated Support Structures
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Solution Overview
Problem
Current packaging and thermal management solutions for electronic circuitry in aerospace and similar applications result in large, heavy, and thermally limited line-replaceable unit designs, necessitating improved form factors with reduced volume, weight, and enhanced thermal management.
Innovation Solution
Conduction cooled modules with external support structures that form a component envelope, incorporating thermally conductive substrates and heat exchanger surfaces, and optionally using composite materials with graphene particles, to facilitate efficient heat transfer and electromagnetic interference attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging and thermal management solutions are used for electronic circuitry, then structural support and thermal management are provided, but the designs result in large volume, heavy weight, and thermal limitations
Solution Approach 1:
The patent merges the support structure and thermal management functions into a single integrated cold plate assembly. The external support structures serve dual purposes: providing mechanical support for the circuit card and acting as heat conduction pathways to transfer heat from the circuit card to the cold plate, thereby eliminating the need for separate cooling components and reducing overall module volume
Solution Approach 2:
The external support structures are designed to perform multiple functions simultaneously: structural support for the circuit card, heat conduction from the circuit card to the cold plate, and electromagnetic shielding. This multi-functionality reduces the number of separate components needed, thereby decreasing module volume and weight while improving thermal management
2Weight of moving object
If conventional packaging solutions are used, then structural support is provided, but the designs result in heavy weight
Solution Approach 1:
The patent employs composite materials for the external support structures that provide high strength-to-weight ratio. These composite structures maintain the necessary structural support capability for the circuit card while significantly reducing the overall weight of the module compared to conventional metal-based support structures
3Temperature
If conventional thermal management designs are used, then thermal management is provided, but the designs result in large volume and thermal limitations
Solution Approach 1:
The support structures and thermal management system are merged into a single integrated cold plate assembly. The external support structures directly conduct heat from the circuit card to the cold plate, eliminating the need for separate heat sinks, thermal interfaces, and cooling components, thereby reducing cooling system volume while improving thermal management efficiency
Solution Approach 2:
The thermal management system is segmented into distributed heat conduction pathways through the external support structures, allowing heat to be removed from multiple locations on the circuit card simultaneously. This segmentation improves thermal management efficiency by reducing thermal hotspots while minimizing the volume required for cooling components
4Adaptability or versatility
If additional equipment is installed to provide new electronic functions, then electronic system functionality is expanded, but additional equipment installation volumes are required
Solution Approach 1:
The integrated module design with multi-functional external support structures creates a compact platform that can accommodate various electronic components and configurations. This universal design allows different electronic system functions to be installed within the same module volume, eliminating the need for additional equipment installation volumes when expanding functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These modules achieve reduced weight and volume, improved thermal management, and increased payload capability, enabling the installation of new electronic functions within existing equipment bays without additional space, while reducing installation times and maintaining electromagnetic compatibility.
Implementation Method 1
the first and second support structures form a continuous, and, in some implementations, a primary heat conduction pathway between the printed wiring board and the cold plate
Implementation Method 2
the first and/or second external support structures comprise one or more heat exchanger surfaces extending into the component envelope
Implementation Method 3
a conduction cooled module described herein can have a structure that permits reduced equipment installation times. Moreover, in some implementations, a conduction cooled module described herein can provide decreased weight for electrical and/or electronic systems, providing increased payload capability for aerospace or similar applications. Further, in some implementations, a conduction cooled module described herein contains electromagnetic emissions within the module and/or attenuates electromagnetic interference
Data Source
AI summary
In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.