Conduction Path Wire Routing Groove Heat Dissipation

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Solution Overview

Problem

Existing methods for heat dissipation in electrical wires, such as those in vehicles, face challenges due to low thermal conductivity of air and potential deformation of insulating covers leading to reduced heat dissipation, especially with larger wire cross-sectional areas.

Innovation Solution

A conduction path design featuring a wire with a circular cross-section and an insulating cover, routed through a groove with a curved surface and a cover attachment that maintains a specific distance from the wire, preventing pressure-induced deformation and enhancing heat transfer through the routing member and cover.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat-dissipating cover member with high thermal conductivity is provided on the insulating cover, then heat dissipation efficiency is improved, but the thermal conductivity of air limits further heat dissipation enhancement

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat dissipation capacity

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The patent introduces a cooling member as an intermediary element between the wire and the surrounding environment. This cooling member has a cooling surface that directly contacts the insulating cover and conducts heat away from the wire, serving as a mediator to overcome the low thermal conductivity of air and enhance heat dissipation capacity

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from a one-dimensional heat dissipation approach (cover member on insulating cover) to a multi-dimensional approach by introducing a routing groove structure with a cooling member that creates additional heat transfer paths through the groove walls and cooling surface, effectively utilizing three-dimensional space for heat dissipation

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the cross-sectional area of the wire is increased to reduce temperature rise, then heat production is reduced, but the size of the wire increases

Engineering Contradiction:

Improvetemperature riseVSAvoidwire size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent extracts the heat dissipation function from the wire itself and implements it through a separate routing groove structure with a cooling member. This allows the wire to maintain its original size while the external structure handles the heat dissipation, effectively separating the electrical conduction function from the thermal management function

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If pressure is applied to the wire by the routing groove or cover to improve heat contact, then heat dissipation is enhanced, but the insulating cover deforms and permanent gaps form

Engineering Contradiction:

Improveheat dissipationVSAvoidinsulating cover integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the geometric parameters of the routing groove, specifically setting the curvature radius of the groove to be larger than the radius of the wire. This parameter change ensures that the wire naturally contacts the groove surface without requiring excessive compression force, thereby maintaining both heat dissipation effectiveness and insulating cover integrity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The routing groove structure is designed in advance with sufficient curvature radius to prevent direct sharp contact points between the wire and groove. This beforehand cushioning design distributes the contact pressure evenly, preventing deformation of the insulating cover before it can occur

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design increases heat dissipation of wires by efficient heat transfer while preventing deformation and permanent gaps, maintaining effective thermal conductivity and electromagnetic shielding.

Implementation Method 1

heat that is produced by wires when the wires conduct electricity

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

heat that is produced by the wire when the wire conducts electricity is transmitted to the routing member via the wire and the routing groove, and is transmitted to the cover in the order of the wire and then the cover

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11273773B2Conduction path

Publication Date: 2022.03.15 AUTONETWORKS TECH LTD

AI summary

A conduction path includes: a wire that has a circular cross section and includes a conductive body having an outer periphery covered by an insulating cover; a routing member that includes a routing groove in which the wire is routed; and a cover that is configured to be attached to the routing member and to cover the routing groove, wherein a curved surface having a curvature radius that is larger than the radius of the wire is formed in an inner surface of the routing groove, and in a state in which the cover is attached to the routing member, a distance between the cover and the inner surface of the routing groove in a direction that is perpendicular to an inward surface of the cover is the same length as the diameter of the wire.