Heat Dissipation Structure With Conduction Sheet for Plug-In Modules
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Solution Overview
Problem
The gap around plugged-in electronic elements in electronic devices creates an air layer with high thermal resistance, leading to poor heat dissipation effects.
Innovation Solution
A heat dissipation structure comprising a housing with an accommodating groove, a heat conduction sheet, and a thin film that covers the groove and inclined surface, allowing direct heat transfer and guiding the pluggable heat source for efficient insertion and reducing contact risks during plugging/unplugging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a gap is reserved around the pluggable electronic element to ensure smooth plugging and unplugging, then the ease of operation is improved, but the heat dissipation performance deteriorates due to the formation of an air layer with high thermal resistance
Solution Approach 1:
A heat conduction sheet is introduced as an intermediary substance to fill the gap between the pluggable electronic element and the housing. This sheet has high thermal conductivity to conduct heat away from the electronic element while also providing a low-friction surface that maintains smooth plugging and unplugging operations.
Solution Approach 2:
The physical and chemical parameters of the gap-filling material are changed from air (high thermal resistance) to a heat conduction sheet material (low thermal resistance, low friction coefficient). This parameter change simultaneously improves heat dissipation while maintaining operational smoothness.
2Loss of substance
If the thin film is made thinner to reduce material usage and cost, then the loss of substance is reduced, but the structural strength and reliability deteriorate
Solution Approach 1:
The thickness parameter of the thin film is optimized to a specific range (10% to 35% of the heat conduction sheet thickness) that balances material reduction with sufficient mechanical strength and functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation effects and structural stability by facilitating direct heat transfer and minimizing thin film damage during plugging/unplugging operations.
Implementation Method 1
The heat conduction sheet is accommodated in the accommodating groove... a pluggable heat source can directly dissipate heat through the heat conduction sheet
Implementation Method 2
the coefficient of friction of the thin film is less than the coefficient of friction of the heat conduction sheet... the thin film on the housing can further assist the pluggable heat source to be inserted with minimal effort
Data Source
AI summary
A heat dissipation structure includes a housing, a heat conduction sheet and a thin film. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface. The accommodating groove is recessed on the supporting surface. The inclined surface is connected to the supporting surface, and is located on one side of the accommodating groove. The heat conduction sheet is accommodated in the accommodating groove, and a surface of the heat conduction sheet is in aligned with a surface of the supporting surface. The thin film covers the supporting surface, the heat conduction sheet and the inclined surface. An electronic device including the above housing and heat conduction sheet is further provided.