Conductive Adhesive Dispersion Using Compatibility Agents
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Solution Overview
Problem
The mass production of conductive adhesives containing one-dimensional (1D) conductive nanomaterials, such as silver nanowires, is hindered by incompatibility between aqueous solutions and solvent-based resins, leading to aggregation and poor dispersion, which limits conductivity and increases manufacturing costs.
Innovation Solution
A method involving the dispersion of 1D conductive nanomaterials in ethanol, followed by mixing with a resin solution, and subsequent heating to form a conductive adhesive, which modifies rheological properties and ensures even dispersion without aggregation, using water-based or solvent-based resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aqueous solution containing silver nanowires is mixed with solvent-based resin, then conductive adhesive can be formed, but aggregation occurs and dispersion is poor due to incompatibility
Solution Approach 1:
The patent introduces a compatibility agent as an intermediary substance between the aqueous silver nanowire solution and solvent-based resin. This agent contains both hydrophilic groups (to interact with water and silver nanowires) and hydrophobic groups (to interact with solvent-based resin), enabling compatible mixing and preventing aggregation while maintaining uniform dispersion and conductivity.
2Manufacturing precision
If precision etching and micro-transfer printing technology are used to produce transparent conductive films, then 1D silver nanostructures can be formed, but manufacturing cost is high and processes are complicated
Solution Approach 1:
The patent changes the manufacturing approach from precision etching and micro-transfer printing to a simple coating process. By modifying the chemical composition of the conductive adhesive (adding compatibility agents and using appropriate solvents), the patent enables direct coating and low-temperature curing to form high-quality transparent conductive films, dramatically simplifying the manufacturing process while maintaining film formation quality.
3Manufacturing precision
If conventional coating processes are avoided to maintain high quality, then manufacturing cost increases, but industrial adaptability decreases
Solution Approach 1:
The patent copies the successful formulation approach from water-based systems to solvent-based systems by using compatibility agents with dual solubility characteristics. This allows conventional industrial coating processes to be used while maintaining high film quality, making the technology adaptable to existing manufacturing infrastructure and reducing implementation costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in conductive adhesives with improved conductivity and reduced material usage, offering better industrial applicability and environmental adaptability while minimizing manufacturing costs.
Implementation Method 1
Add and disperse one conductive nanomaterial into ethanol to form a nanosacle dispersing solution
Implementation Method 2
Heat and concentrate the colloidal mixture so as to get a conductive adhesive
Data Source
AI summary
A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.