Thermally Conductive Adhesive Composition for High-Temperature Bonding
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Solution Overview
Problem
Electrically conductive adhesives used in electronic components face a challenge in maintaining adhesiveness and heat dissipation at high temperatures due to the insufficient heat resistance of resinous ingredients, leading to reduced bonding performance.
Innovation Solution
A thermally-conductive and electrically-conductive adhesive composition is developed, featuring silver powder with a specific average particle diameter and tap density range, combined with an epoxy resin, reactive diluent, and curing agent, to enhance adhesiveness and heat-conducting properties in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-temperature lead solders or gold-tin solders are used to improve heat dissipation properties, then thermal conductivity is improved, but harmful factors increase (lead toxicity) or cost increases (gold content)
Solution Approach 1:
The patent replaces expensive and harmful traditional solders with a cost-effective, lead-free electrically conductive adhesive composition. The composition uses inexpensive metal particles (silver, nickel, copper, aluminum, or gold) combined with organic adhesive, eliminating lead toxicity while maintaining electrical and thermal conductivity functions.
Solution Approach 2:
The patent creates a composite material system combining metal particles (for electrical and thermal conductivity) with organic adhesive (for bonding function). This composite approach achieves the required heat dissipation properties without using harmful lead-based or expensive gold-based solders, resolving both the harmful factors and cost issues.
2Ease of manufacture
If organic adhesive is used as the base material for electrically conductive adhesive, then ease of manufacture and cost are improved, but thermal conductivity deteriorates due to lower heat resistance at high temperatures
Solution Approach 1:
The patent combines organic adhesive (providing ease of manufacture and bonding function) with high proportions of thermally conductive metal particles (providing heat resistance and thermal conductivity). This composite structure allows the adhesive to maintain its processing advantages while achieving the necessary high-temperature heat dissipation performance through the metallic filler network.
Solution Approach 2:
The patent optimizes the composition parameters by controlling the proportion of metal particles (5-80 wt%) and organic adhesive (20-95 wt%), and by specifying particle size ranges (0.001-30 μm). These parameter adjustments enhance thermal conductivity and heat resistance while maintaining the ease of manufacture inherent to organic adhesive systems.
3Temperature
If metal particles are incorporated to improve electrical conductivity and thermal conductivity, then heat dissipation properties are improved, but manufacturing complexity increases due to particle distribution control
Solution Approach 1:
The patent specifies precise parameter ranges for metal particles including size (0.001-30 μm), shape (spherical, flaky, or irregular), and composition (5-80 wt% of total composition). These controlled parameters facilitate uniform particle distribution and simplify manufacturing processes while achieving the desired thermal and electrical conductivity properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits high adhesiveness and heat-conducting properties while maintaining stability and cost-effectiveness, forming metallic bonds with adherend materials even at elevated temperatures.
Implementation Method 1
the bonding materials are desired to have high heat dissipation properties
Implementation Method 2
metal particles having functions including electrical conductivity (e.g., silver, nickel, copper, aluminum, and gold)
Implementation Method 3
forming metallic bonds with adherend materials even at elevated temperatures
Data Source
AI summary
The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.