Conductive Adhesive Electrode Connections for Stacked Optical Devices
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Solution Overview
Problem
Current methods for connecting electrodes in optical devices are cumbersome and inefficient, particularly when stacking multiple devices to handle non-polarized light and achieve high optical power, leading to clumsy integration and unreliable electrical connectivity.
Innovation Solution
A method involving the deposition of electrically-conductive adhesive material on electrodes, followed by cutting the devices to expose the adhesive for connection with a driving circuit, creating a stable and reliable conductive pathway for electrical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent conductive material is connected using anisotropic conductive film to bond electrode to FPCB, then electrical connection is established, but integration becomes clumsy and reliability decreases when stacking multiple optical devices
Solution Approach 1:
The patent merges the electrical connection function and mechanical bonding function into a single electrically-conductive adhesive material layer. This adhesive simultaneously provides electrical conductivity to connect the ITO electrode to the FPCB and mechanical adhesion to bond the optical device components, eliminating the need for separate connection layers and reducing integration complexity while improving reliability.
Solution Approach 2:
The patent uses an electrically-conductive adhesive material that combines adhesive properties with electrical conductivity in a single composite material. This composite material integrates the functions of both adhesive bonding and electrical connection, simplifying the multi-layer structure and improving reliability by reducing potential failure points at interfaces between separate materials.
2Illumination intensity
If multiple layers of optical devices are stacked to handle non-polarized light and achieve high optical power, then optical performance is improved, but connection and integration become very difficult
Solution Approach 1:
The patent applies the electrically-conductive adhesive material to the ITO electrode before stacking the optical devices. This preliminary application of conductive adhesive ensures that electrical connections are pre-established and secured before the stacking process, making subsequent assembly easier and more reliable. The adhesive is positioned and prepared in advance, facilitating straightforward integration of multiple device layers.
3Productivity
If conventional connection methods are used for stacked optical devices, then manufacturing can proceed, but electrical connectivity becomes unreliable and integration is clumsy
Solution Approach 1:
The patent combines electrical connection and mechanical bonding into a single electrically-conductive adhesive layer, eliminating the need for separate connection components. This merging simplifies the manufacturing process by reducing the number of assembly steps and components, improving productivity while simultaneously enhancing electrical connectivity reliability through a unified connection mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and enhances the manufacturing process, ensuring continuous and reliable electrical connectivity between electrodes and driving circuits, allowing for efficient assembly and operation of optical devices, even in stacked configurations.
Implementation Method 1
electrically connecting a driving circuit of the optical device with the electrically-conductive adhesive material deposited on the first part of the first electrode, to provide an electrical connection between the driving circuit and the first electrode
Implementation Method 2
depositing an electrically-conductive adhesive material on a first part of a first electrode
Data Source
Figure 1
Figure 2A~2B
Figure 3~4
AI summary
Disclosed is a method for manufacturing an optical device (102A). An electrically-conductive adhesive (ECA; 114) material is deposited on a first part of a first electrode (106) deposited on a first substrate (104). A layer (112) of at least one active material is formed between the first substrate and a second substrate (108), wherein the first electrode is disposed between the first substrate and said layer, and a second electrode (110) is disposed between the second substrate and said layer. The optical device is cut through the first part of the first electrode, thereby exposing the ECA material deposited on the first part of the first electrode. A driving circuit (208) of the optical device is electrically connected with the ECA material deposited on the first part of the first electrode, to provide an electrical connection between the driving circuit and the first electrode.