Conductive Adhesive Composition for Low-Temperature Implant Assembly
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Solution Overview
Problem
Current electrical connections in active implantable medical devices face challenges such as durability, biocompatibility, and the limitations of high-temperature assembly processes, which can lead to material fractures and reduced device lifetime, especially with the trend towards miniaturization.
Innovation Solution
An electrically conductive adhesive comprising a (meth)acrylate monomer, a biocompatible polymer, a biocompatible metal with a median particle size below 50 μm, and a polymerization initiator, which forms a conductive matrix suitable for connecting electronic parts in implantable medical devices under mild conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding or brazing processes are used to create electrical connections, then electrical connection reliability is improved, but high temperature causes material fractures and reduces device lifetime
Solution Approach 1:
The invention changes the temperature parameter from high (welding/brazing) to low (room temperature or mild heating), enabling electrical connections without thermal damage to surrounding materials. The adhesive composition is specifically designed to cure at low temperatures, transforming the processing conditions to avoid material fractures while maintaining connection reliability.
Solution Approach 2:
The invention replaces the mechanical/thermal joining processes (welding, brazing) with a chemical bonding process using electrically conductive adhesive. This substitution eliminates the need for high temperature and mechanical stress during assembly, preventing microfractures in ceramic/metal composite feedthroughs while providing reliable electrical connections.
2Ease of manufacture
If mechanically fastening electrical components is used, then assembly is simplified, but connection durability decreases due to fatigue risk
Solution Approach 1:
The invention merges the mechanical bonding function with electrical conductivity in a single adhesive material. The electrically conductive adhesive simultaneously provides mechanical attachment and electrical connection, eliminating the need for separate mechanical fasteners and reducing fatigue risks associated with mechanical connections.
Solution Approach 2:
The invention uses a composite material system consisting of adhesive matrix combined with electrically conductive filler particles. This composite provides both the mechanical properties needed for durable bonding and the electrical conductivity required for signal/ power transmission, creating a single integrated solution that avoids mechanical fatigue.
3Ease of manufacture
If conventional adhesives are used, then manufacturing is simplified, but electrical conductivity is insufficient for medical implant applications
Solution Approach 1:
The invention creates an electrically conductive composite adhesive by dispersing conductive filler particles (such as metal powders or conductive carbon materials) within an adhesive matrix. This composite structure maintains the ease of application and bonding characteristics of conventional adhesives while introducing sufficient electrical conductivity for medical implant applications.
Solution Approach 2:
The invention applies local quality by concentrating electrical conductivity in specific regions through the distribution of conductive filler particles within the adhesive. The adhesive matrix provides bonding functionality while the locally distributed conductive particles provide electrical pathways, achieving both manufacturing simplicity and electrical reliability.
4Strength
If high temperature processing is used, then electrical connection strength is improved, but biocompatibility is compromised due to material degradation
Solution Approach 1:
The invention changes the curing temperature parameter from high temperature to low temperature processing. The adhesive formulation is specifically designed to achieve adequate bond strength at low temperatures through optimized chemistry and filler content, eliminating thermal damage to biocompatible materials while maintaining connection strength.
Solution Approach 2:
The invention uses a single-shot adhesive application that cures at low temperature to create permanent bonds, replacing processes that require high temperature. This approach sacrifices the extreme heat resistance of welding but gains biocompatibility and suitability for sensitive medical implant materials, achieving adequate strength without thermal degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive provides a durable, biocompatible, and reliable electrical connection suitable for miniaturized medical devices, reducing the risk of material failure and enabling long-term use within the body while avoiding high-temperature assembly limitations.
Implementation Method 1
an electrically conductive adhesive comprising a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 μm, and d) a polymerization initiator
Data Source
AI summary
The present invention refers to an electrically conductive adhesive comprising a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 µm, and d) a polymerization initiator. The present invention also refers to a kit for preparing an electrically conductive adhesive, to an implantable medical device comprising such an electrically conductive adhesive, or a cured form thereof, and to the use of such an electrically conductive adhesive.