Conductive Adhesive Composition for Low-Pressure Electronic Connections
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Solution Overview
Problem
Conductive adhesives face challenges in achieving desired conductivity at low pressure and maintaining reliability, especially when electronic components are connected, as they tend to extrude and fail to maintain conductivity with temperature changes.
Innovation Solution
An adhesive composition comprising first conductive particles with projections capable of penetrating oxide films and second conductive particles with nonconductive cores and conductive layers, such as gold, nickel, or palladium, is used to enhance conductivity and prevent adhesive outflow during low-pressure connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If low pressure is applied during connection, then adhesive outflow is suppressed, but electrical conductivity is insufficient
Solution Approach 1:
The conductive particles are segmented into two distinct types with different functions: first conductive particles (needle-shaped) for penetrating oxide films and establishing electrical contact, and second conductive particles (spherical with conductive coating) for providing continuous conductive pathways. This segmentation allows each particle type to optimize its specific function without compromising the other, enabling good conductivity at low pressure without adhesive outflow.
Solution Approach 2:
Different regions of the adhesive composition have different functional qualities: the first conductive particles provide localized oxide penetration capability at the electrode interface, while the second conductive particles provide distributed conductive pathways throughout the adhesive matrix. This local quality differentiation allows the system to achieve both low-pressure bonding and reliable conductivity simultaneously.
2Reliability
If high pressure is applied to improve conductivity, then electrical connection is enhanced, but adhesive component extrudes and flows out
Solution Approach 1:
The conductive particles are segmented into two distinct types with different functions: first conductive particles (needle-shaped) for penetrating oxide films and establishing electrical contact, and second conductive particles (spherical with conductive coating) for providing continuous conductive pathways. This segmentation allows each particle type to optimize its specific function without compromising the other, enabling good conductivity at low pressure without adhesive outflow.
3Ease of manufacture
If conventional conductive particles are used, then manufacturing is simple, but conductivity and reliability are insufficient
Solution Approach 1:
The adhesive composition uses a composite system of two different conductive particle types: needle-shaped first conductive particles for oxide penetration and spherical second conductive particles with conductive coatings for pathway formation. This composite particle system combines the advantages of different particle geometries and materials, achieving superior conductivity and reliability while remaining manufacturable through conventional mixing and application processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves excellent conductivity at low pressures while preventing adhesive outflow and maintaining reliability across temperature changes, offering improved performance compared to existing conductive films.
Implementation Method 1
a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member
Implementation Method 2
a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body
Data Source
AI summary
One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.