Conductive Adhesive Composition for Strength and Low Resistance

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Solution Overview

Problem

Existing electrically conductive adhesives face challenges in achieving both good adhesive strength and conductivity, with a focus on adhesive strength being insufficiently addressed in previous solutions.

Innovation Solution

An electrically conductive adhesive composition comprising a conductive powder, a curable component, and a phosphoric acid-containing curable component within specific molecular weight ranges, which enhances adhesive strength and reduces resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the content of conductive powder is reduced to improve adhesive strength, then adhesive strength improves, but the resistance of the cured product increases

Engineering Contradiction:
Improveadhesive strengthVSAvoidconductivity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The phosphoric acid-containing curable component acts as an intermediary that enhances the interfacial bonding between the adhesive and conductive powder particles. The phosphoric acid groups create strong chemical bonds with metal conductive powders, improving the effectiveness of each particle. This allows reduced conductive powder content while maintaining conductivity, as the enhanced particle-matrix bonding improves electron transfer efficiency at particle interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conductive powder content is optimized for conductivity, then good conductivity is achieved, but adhesive strength becomes insufficient

Engineering Contradiction:
ImproveconductivityVSAvoidadhesive strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent creates a composite adhesive system combining three components: base curable component (epoxy/benzoxazine resin), phosphoric acid-containing curable component, and conductive powder. The phosphoric acid-containing component serves as a coupling agent that bridges the organic resin matrix and inorganic conductive particles, creating a tri-phase composite structure. This composite approach allows simultaneous optimization of conductivity (through conductive powder network) and adhesive strength (through phosphoric acid-mediated bonding).

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved adhesive strength and reduced resistance in the cured product, allowing for effective adhesion and conductivity even with a reduced content of conductive powder.

Implementation Method 1

a phosphoric acid-containing curable component (C) having a general formula of the following formula (1) or (2), and having a molecular weight within a range of 150 to 1000

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Data Source

PatentUS12552972B2Conductive adhesive composition
Publication Date: 2026.02.17 KYOTO ELEX
  • US12552972B2 patent drawing
  • US12552972B2 patent drawing
  • US12552972B2 patent drawing

AI summary

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.