Conductive Adhesive Bond for Semiconductor Component Integration
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Solution Overview
Problem
Existing methods for connecting components to a semiconductor body require complex mechanical attachments and additional electrical connections, which are costly and prone to reliability issues, especially in microelectronic assemblies like gas sensors.
Innovation Solution
An integrated component with a conductive adhesive connection using an organic polymer connecting means that forms a non-positive electrical connection between a semiconductor body and separate components, eliminating the need for mechanical attachments and additional electrical connections by penetrating the passivation and oxide layers, and featuring conductive layers on the bottom and side surfaces for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex mechanical attachments and additional electrical connections are used, then reliable electrical connection is achieved, but device complexity and production cost increase
Solution Approach 1:
The patent combines mechanical attachment and electrical connection functions into a single integrated component. The formation structure provides both mechanical support and electrical conductivity through its conductive layer, eliminating the need for separate mechanical attachments and electrical connections. This merging of functions directly reduces device complexity while maintaining connection reliability.
Solution Approach 2:
The formation structure serves multiple functions simultaneously: it provides mechanical support for the component, establishes electrical connection through the conductive layer, and creates a non-positive connection with the semiconductor body. This multi-functionality eliminates the need for multiple separate components, thereby reducing overall device complexity while ensuring reliable electrical connection.
2Reliability
If complex mechanical attachments and additional electrical connections are used, then reliable electrical connection is achieved, but production cost increases
Solution Approach 1:
By merging mechanical attachment and electrical connection into a single formation structure, the patent reduces the number of manufacturing steps. Instead of separately attaching mechanical components and then adding electrical connections, the formation is created in one integrated process, significantly reducing production cost while maintaining connection reliability.
Solution Approach 2:
The conductive layer is formed within the formation structure during the manufacturing process before final assembly. This preliminary action of pre-forming the conductive pathway eliminates the need for subsequent complex electrical connection steps, reducing both production cost and manufacturing complexity while ensuring reliable electrical connection.
3Reliability
If conventional connection methods are used, then electrical connection is established, but overall height and contamination risk increase
Solution Approach 1:
The conductive layer is nested within the formation structure, with the formation penetrating through the passivation layer and oxide layer to reach the semiconductor body. This nested configuration allows the electrical connection to be established within the existing vertical structure without adding significant overall height, while the formation provides mechanical stability and contamination protection.
4Reliability
If conventional connection methods are used, then electrical connection is established, but contamination resistance decreases
Solution Approach 1:
The passivation layer and oxide layer form protective thin film structures that seal and protect the conductive layer and formation interface from environmental contamination. These flexible protective layers maintain electrical connection stability while providing robust contamination resistance, eliminating the need for additional protective structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables simple, reliable, and cost-effective electrical connections between semiconductor bodies and separate components, reducing production costs and overall height, while providing a robust and contamination-resistant interface.
Implementation Method 1
a formation penetrating the passivation layer and the oxide layer is formed
Implementation Method 2
which comprises an organic polymer, which forms a non-positive connection between a component formed above the passivation layer and the semiconductor body
Data Source
Figure 1~2
AI summary
Conductive adhesive bond for connecting a component (60), e.g., the gate electrode of a gas sensor, to a semiconductor body (20) containing an integrated circuit. A recess (70) penetrating the passivation layer (50) and oxide layer (40) is filled with a conductive adhesive (80) based on an organic polymer, so that the conductive underside of the component (60) and a conductive contact surface (30) are connected by the conductive adhesive (80). To strengthen the adhesive bond, raised areas (100) can be formed in the recess (70), increasing the effective contact area of the adhesive bond.