Conductive Adhesive Layer for Solar Panel Charge Evacuation
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Solution Overview
Problem
Solar panels in space, particularly those in geostationary orbit, face damage due to charge accumulation on dielectric materials and protective glass plates during solar eclipses, as conventional adhesives like epoxy and silicone become insulating at low temperatures, failing to effectively evacuate charges.
Innovation Solution
Incorporating conductive means, such as intersecting metal wires or grids, in contact with dielectric materials and connected to the ground, to ensure charge evacuation through adhesives like Kapton® or silicone, maintaining conductivity across various temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If epoxy or silicone adhesives are used to bond dielectric materials and protective glass plates, then structural integrity and ease of manufacture are improved, but charge evacuation capability deteriorates at low temperatures during solar eclipses
Solution Approach 1:
The adhesive system is segmented into multiple functional layers: a structural adhesive layer (epoxy or silicone) providing mechanical bonding, and a conductive adhesive layer containing metal particles that provides charge evacuation pathways. This segmentation allows each layer to specialize in its primary function while working together as an integrated system.
Solution Approach 2:
The invention uses composite adhesive materials combining organic adhesive matrices (epoxy or silicone) with dispersed conductive metal particles. This composite structure maintains the bonding strength of the organic adhesive while introducing charge conduction pathways through the metal particles, solving the contradiction between structural integrity and charge evacuation capability.
2Ease of operation
If conventional adhesives are used to maintain structural integrity, then ease of operation is improved, but charge evacuation capability worsens at temperatures below 30°C
Solution Approach 1:
The invention changes the electrical parameter (conductivity) of the adhesive system by adding metal particles, while maintaining the mechanical parameters (bonding strength, flexibility) provided by the organic adhesive matrix. This allows the adhesive to maintain its operational ease while gaining charge evacuation capability across a wide temperature range.
3Strength
If dielectric materials and protective glass plates are used for their insulating properties, then structural function is improved, but charge accumulation increases during solar eclipses
Solution Approach 1:
The conductive adhesive layer acts as an intermediary between the dielectric materials/protective glass plates and the conductive frame. It provides a controlled charge evacuation pathway that allows excess charges to be safely discharged to ground potential without compromising the insulating function of the dielectric materials during normal operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively evacuates charges from dielectric materials and protective glass plates, preventing damage to solar panels by maintaining conductivity even at low temperatures, thus ensuring reliable operation during solar eclipses.
Implementation Method 1
there is a means of connection for connecting said conductive means to the ground of said structure... ensures the function of evacuating the charges which accumulate on a layer of dielectric material
Implementation Method 2
a solar panel, of the type comprising at least one layer of dielectric material... array of solar cells
Data Source
Figure 1~9
Figure 5~10
AI summary
The invention relates to a structural element (1) for a solar panel, comprising at least one layer of dielectric material (3), notable in that it includes conductive means (5) which are in contact with said layer of dielectric material (3) and a connecting means (9) for connecting the conductive means (5) to the mass of said structure.