Conductive Pressure-Sensitive Adhesive Tape for Flexible Devices
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Solution Overview
Problem
Conductive pressure-sensitive adhesive tapes used in flexible devices and wearable technology face challenges in maintaining conductivity and bending resistance when repeatedly bent, as existing tapes experience reduced conductivity in X- and Y-axis directions after thinning.
Innovation Solution
A conductive pressure-sensitive adhesive tape with a total thickness of 30 μm or less, featuring a thin metal foil base material and a pressure-sensitive adhesive layer containing a conductive filler with a specific particle diameter and aspect ratio, ensuring high bending resistance and sustained conductivity in all directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the total thickness of the conductive pressure-sensitive adhesive tape is reduced to achieve thinning for flexible devices, then the flexibility and adaptability are improved, but the bending resistance deteriorates causing extreme reduction in conductivity in X- and Y-axis directions after repeated bending
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness of the base material (1-10 μm) and pressure-sensitive adhesive layer (1-20 μm) to achieve optimal balance between flexibility and bending resistance. The total thickness is controlled at 30 μm or less while maintaining conductivity through specific thickness parameters that prevent excessive conductivity loss during repeated bending.
Solution Approach 2:
The patent uses composite materials by combining a metal foil base material with a conductive pressure-sensitive adhesive layer containing conductive fillers (such as nickel powder). This composite structure provides both the flexibility needed for thin designs and the conductivity required for electrical connections, while the specific composition maintains bending resistance.
2Volume of moving object
If the thickness of the base material and pressure-sensitive adhesive layer are reduced to achieve thinning, then the total thickness is decreased for flexible device applications, but the conductivity in X- and Y-axis directions is reduced after repeated bending
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness parameters of each layer: base material thickness of 1-10 μm and pressure-sensitive adhesive layer thickness of 1-20 μm. These specific parameter ranges achieve the goal of thinning (total thickness ≤30 μm) while maintaining sufficient conductivity even after repeated bending through carefully controlled dimensional parameters.
Solution Approach 2:
The patent applies local quality by ensuring that the conductive filler is properly distributed within the pressure-sensitive adhesive layer, creating localized conductive pathways that maintain electrical conductivity. The specific composition and distribution of conductive fillers in the adhesive layer provide localized conductivity that persists through bending cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape achieves high flexibility and maintains sufficient conductivity in Z-axis and X- and Y-axis directions even after repeated bending, making it suitable for applications like flexible OLEDs and wearable devices.
Implementation Method 1
a pressure-sensitive adhesive layer formed of a specific conductive filler-containing pressure-sensitive adhesive
Implementation Method 2
the base material formed of the metal foil has a thickness of from 10 μm to 100 μm
Data Source
AI summary
Provided is a conductive pressure-sensitive adhesive tape having high flexibility. The conductive pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on at least one surface side of the base material, in which the tape has a total thickness of 30 μm or less.