Conductive Adhesive Tape for Foldable Display Reliability

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Solution Overview

Problem

Foldable display devices face challenges in maintaining reliability due to stress concentrations and deformation issues during folding and unfolding operations, which can lead to reduced durability and increased risk of damage.

Innovation Solution

The use of a conductive adhesive tape with a conductive nonwoven fabric layer, a first conductive adhesive layer, and a second conductive adhesive layer is introduced between the flexible circuit film and the support plate, providing a static-electricity path and alleviating deformation by compensating for surface irregularities, thereby enhancing the structural integrity of the display device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid support plate is used to maintain structural stability, then structural stability is improved, but deformation and stress concentration occur during folding operations reducing reliability

Engineering Contradiction:
Improvestructural stabilityVSAvoidreliability during folding
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent replaces the rigid support plate with a flexible circuit film that can bend and deform during folding operations. The flexible circuit film includes a flexible substrate with conductive patterns that maintain electrical connectivity while accommodating the mechanical stress of folding, thus preventing stress concentration and improving reliability during folding operations while maintaining structural stability through its flexible nature

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the mechanical parameters of the support structure by transitioning from a rigid plate to a flexible film with specific mechanical properties. The flexible circuit film is designed with appropriate thickness, flexibility, and conductive pattern geometry to maintain both structural stability and reliability during dynamic folding operations

Inventive Principle:
Principle #35Parameter changes

2Strength

If conventional adhesive is used to bond the flexible circuit film to the support plate, then bonding is achieved, but static electricity accumulates causing damage to electronic components

Engineering Contradiction:
Improvebonding strengthVSAvoidstatic electricity damage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a conductive adhesive layer as an intermediary between the flexible circuit film and the support plate. This conductive adhesive serves dual functions: it provides the necessary bonding strength to secure the flexible circuit film while simultaneously acting as an electrostatic discharge (ESD) path to prevent static electricity accumulation that could damage electronic components

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite adhesive structure consisting of a conductive adhesive layer with specific electrical and mechanical properties. This composite material combines the bonding capabilities of traditional adhesives with the electrostatic dissipation properties of conductive materials, achieving both strong adhesion and static electricity protection

Inventive Principle:
Principle #40Composite materials

3Stability of the object's composition

If the flexible circuit film is directly bonded to the support plate, then structural integrity is maintained, but surface irregularities cause deformation and reduced durability

Engineering Contradiction:
Improvestructural integrityVSAvoiddurability during folding
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent introduces a conductive adhesive layer as a mediator between the flexible circuit film and the support plate. This adhesive layer compensates for surface irregularities and dimensional mismatches between the two components, providing a buffer that reduces stress concentration and deformation during folding operations, thereby improving durability while maintaining structural integrity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the bonding interface parameters by using a conductive adhesive layer with appropriate thickness and mechanical compliance. This layer changes the interface properties to accommodate surface irregularities and thermal expansion differences, reducing stress concentration and improving the overall reliability and durability of the folded display device

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prevents deformation of the support plate and improves the overall reliability of the display device by providing a reliable static-electricity discharge path and compensating for uneven surfaces, thus enhancing its durability and performance during folding and unfolding.

Implementation Method 1

the conductive adhesive tape includes a conductive nonwoven fabric layer, a first conductive adhesive layer disposed between the conductive nonwoven fabric layer and the flexible circuit film, and a second conductive adhesive layer disposed between the conductive nonwoven fabric layer and the lower module

Methodology Applied
Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS12181923B2Display device and electronic device including the same
Publication Date: 2024.12.31 SAMSUNG DISPLAY CO LTD
  • US12181923B2 patent drawing
  • US12181923B2 patent drawing
  • US12181923B2 patent drawing

AI summary

A display device includes a display panel, a lower module, a flexible circuit film, and a conductive adhesive tape. The display panel includes a first non-folding area, a second non-folding area, and a folding area. The lower module is disposed under the display panel. The flexible circuit film is coupled to the display panel, and a portion of the flexible circuit film is disposed on a rear surface of the lower module. The conductive adhesive tape is disposed between the lower module and the flexible circuit film. The conductive adhesive tape includes a conductive nonwoven fabric layer, a first conductive adhesive layer, and a second conductive adhesive layer. The first conductive adhesive layer is disposed between the conductive nonwoven fabric layer and the flexible circuit film, and the second conductive adhesive layer is disposed between the conductive nonwoven fabric layer and the lower module.