Conductive Adhesive Transfer via Needle Pickup for Short-Circuit Prevention

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Solution Overview

Problem

Conventional methods of applying conductive adhesive to semiconductor elements on circuit substrates face challenges in accurately controlling the amount of adhesive, leading to potential electrical short-circuits between adjacent pads.

Innovation Solution

A method and device that utilize a carrier plate with a patterned conductive adhesive and a manufacturing device equipped with needles to transfer precise amounts of adhesive to a circuit board, ensuring accurate placement and separation of adhesive portions to prevent short-circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conductive adhesive is directly dispensed or printed on circuit board pads, then the application process is simple and fast, but the amount of adhesive cannot be controlled accurately leading to electrical short-circuits

Engineering Contradiction:

Improveapplication speedVSAvoidadhesive amount control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The conductive adhesive is segmented into discrete conductive particles that are individually transferred to the circuit board pads. The pickup tool captures and transfers particles one by one or in controlled groups, ensuring precise control over the number and placement of each particle, thereby preventing short-circuits while maintaining efficient application.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If conventional dispensing or printing methods are used, then the process is straightforward, but adjacent pads may experience electrical short-circuits due to inaccurate adhesive placement

Engineering Contradiction:

Improveprocess simplicityVSAvoidelectrical short-circuit prevention

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

A pickup tool serves as an intermediary between the conductive adhesive source and the circuit board pads. The tool picks up conductive particles from a source and transfers them to specific pad locations, providing precise control over particle placement and ensuring that adjacent pads remain electrically isolated while maintaining process simplicity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If more conductive adhesive is applied to ensure adequate bonding, then bonding strength is improved, but the risk of electrical short-circuits between adjacent pads increases

Engineering Contradiction:

Improvebonding strengthVSAvoidelectrical short-circuit risk

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The conductive adhesive is applied with local quality control, where each pad receives a precisely controlled number of conductive particles tailored to its specific bonding requirements. This ensures adequate bonding strength for each individual pad while preventing excess adhesive from bridging to adjacent pads, thereby eliminating short-circuit risks.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11626295B2Method of applying conductive adhesive and manufacturing device using the same

Publication Date: 2023.04.11 ENNOSTAR CORP

AI summary

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.