Conductive Adhesive Composition Urethane Resin Reflow Resistance
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Solution Overview
Problem
Conductive adhesives used in printed wiring boards face challenges with reflow resistance and adhesiveness after undergoing high-temperature processes, and the addition of silica particles can reduce adhesion to reinforcing plates and printed wiring boards, especially with smaller openings and insufficient reflow resistance in existing adhesive compositions.
Innovation Solution
A conductive adhesive composition incorporating a thermosetting resin with functional groups reactive with epoxy, epoxy resin, and urethane resin particles with specific particle diameters and hardness ranges, enhancing reflow resistance and adhesiveness to printed wiring boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If silica particles are added to reduce damage to insulating layer, then flexibility is maintained, but adhesion to reinforcing plate and printed wiring board deteriorates
Solution Approach 1:
The patent changes the particle type from silica to urethane resin and adjusts particle size parameters (4-13 μm) and hardness parameters (55-90 on type A durometer) to simultaneously achieve insulating layer protection and maintained adhesion strength
Solution Approach 2:
The patent creates a composite adhesive composition combining thermosetting resin with specific urethane resin particles, where the urethane resin particles provide both protective and adhesive functions that silica particles alone cannot achieve
2Length of moving object
If opening diameter is reduced for smaller electronic substrates, then miniaturization is achieved, but adhesion and conductivity become more difficult to maintain
Solution Approach 1:
The patent optimizes particle size parameters of urethane resin to 4-13 μm, which are specifically sized to effectively fill and adhere in smaller opening diameters while maintaining conductivity and adhesion performance
Solution Approach 2:
The patent uses a composite formulation of thermosetting resin and urethane resin particles that provides enhanced adhesion strength and conductivity in confined spaces, enabling reliable performance in miniaturized openings
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition maintains good conductivity and adhesiveness to printed wiring boards even after reflow processes, with improved reflow resistance and adhesion properties compared to previous adhesive formulations.
Implementation Method 1
a thermosetting resin having a functional group reactive with an epoxy group, an epoxy resin
Implementation Method 2
urethane resin particles having a mean particle diameter of 4 μm or more and 13 μm or less and a hardness of 55 or more and 90 or less measured by a type A durometer
Implementation Method 3
a conductive filler
Data Source
AI summary
Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 μm or more and 13 μm or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.