Conductive Pressure-Sensitive Adhesives With Nanoparticles for Low PIM

The patent changes the physical and chemical parameters of the conductive particles by applying surface treatments (silane coupling agents, metal coatings) and controlling particle morphology (aspect ratio, size distribution). These parameter changes allow the particles to maintain electrical conductivity while reducing PIM interference through optimized electron transport properties and reduced contact resistance variability.

The patent uses composite conductive particle structures combining different materials (e.g., nickel-coated graphite, metal-coated polymer particles) to achieve both high conductivity and low PIM. The composite structure allows the core material to provide conductivity while the coating layer reduces surface oxidation and contact resistance variations that cause PIM.

The patent applies local quality by creating zones of different particle concentrations and types within the adhesive formulation. Surface-active conductive particles are concentrated at the adhesive-substrate interface to maintain conductivity, while the bulk adhesive maintains its adhesive properties. Surface treatments on particles create localized functional zones that enhance both conductivity and adhesion at the interface.

The patent modifies particle parameters (surface chemistry, size, shape) to optimize the balance between conductivity and adhesion. Smaller particles with appropriate surface treatments provide both conductive pathways and strong interfacial bonding, while larger particles provide bulk conductivity. The particle size distribution is controlled to ensure adequate adhesion while maintaining conductivity.